Inventor · disambiguated record
Tung-Chin Yeh
Also filed as: YEH TUNG-CHIN
3 granted patents·1 pending application·18 citations·filing 2003–2016
64Inventor score
Top patents by PatentIndex Score
4 records- 0190US9385079B2Methods for forming stacked capacitors with fuse protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·14 cites·20 claims
- 0281US10014252B2Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·4 cites·20 claims
- 0344US9711474B2Semiconductor package structure with polymeric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 18, 2017·0 cites·20 claims
- 0435US2005112903A1Process for removing tungsten particles after tungsten etch-backTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →