Inventor · disambiguated record
Ming-Kun Weng
Also filed as: WENG MING-KUN
11 granted patents·55 citations·filing 2012–2019
87Inventor score
Files withLITE ON OPTO TECH CHANGZHOU CO LTD5LITE ON ELECTRONICS GUANGZHOU1LITE ON ELECTRONICS GUANGZHOU LTD1SILITEK ELECTRONIC GUANGZHOU1SILITEK ELECTRONICS GUANGZHOU CO LTD1
Top patents by PatentIndex Score
11 records- 0188US9978915B2Manufacturing method of a flip-chip light emitting diode package moduleLITE ON ELECTRONICS GUANGZHOU·Filed 2016·Granted May 22, 2018·6 cites·20 claims
- 0285US9412724B2Chip-scale packaged LED deviceLITE-ON OPTO TECH (CHANGZHOU) CO LTD·Filed 2015·Granted Aug 9, 2016·6 cites·20 claims
- 0382US8729586B2Light-emitting diode deviceWU CHIA-HAO·Filed 2012·Granted May 20, 2014·7 cites·29 claims
- 0479US10383528B2Wearable apparatus and photoplenthysmography sensor unit thereofLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2017·Granted Aug 20, 2019·6 cites·21 claims
- 0577US10107461B2Light-emitting display and method for forming the sameLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2017·Granted Oct 23, 2018·5 cites·20 claims
- 0677USD674758SLight emitting diodeSILITEK ELECTRONIC GUANGZHOU·Filed 2012·Granted Jan 22, 2013·22 cites·1 claims
- 0763US9490404B2Flip-chip light emitting diode package module and manufacturing method thereofLITE ON ELECTRONICS GUANGZHOU LTD·Filed 2014·Granted Nov 8, 2016·1 cites·8 claims
- 0851US11211313B2Lead frame array for carrying chips and LED package structure with multiple chipsLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·19 claims
- 0948US10655828B2LED package structureLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 1033USD674757SPackage carrier of light emitting diodeSILITEK ELECTRONICS GUANGZHOU CO LTD·Filed 2012·Granted Jan 22, 2013·2 cites·1 claims
- 1129US9076856B2Positioning systemWang yan-yi·Filed 2012·Granted Jul 7, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →