Inventor · disambiguated record
Hisahiko Yoshida
Also filed as: YOSHIDA HISAHIKO
8 granted patents·2 pending applications·92 citations·filing 1999–2020
86Inventor score
Files withSENJU METAL INDUSTRY CO4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3PANASONIC CORP2YAMAGUCHI ATSUSHI1
Top patents by PatentIndex Score
10 records- 0177US7993984B2Electronic device and manufacturing methodPANASONIC CORP·Filed 2008·Granted Aug 9, 2011·8 cites·9 claims
- 0276US6440228B1Lead-free zinc-containing solder pasteSENJU METAL INDUSTRY CO·Filed 2001·Granted Aug 27, 2002·19 cites·7 claims
- 0373US6416590B1Solder powder and method for preparing the same and solder pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 9, 2002·35 cites·23 claims
- 0471US9603295B2Mounted structure and manufacturing method of mounted structureYAMAGUCHI ATSUSHI·Filed 2012·Granted Mar 21, 2017·3 cites·13 claims
- 0568US6926849B2Solder pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 9, 2005·14 cites·12 claims
- 0659US7282174B2Lead-free solder and soldered articleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 16, 2007·7 cites·14 claims
- 0757US6736907B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2002·Granted May 18, 2004·6 cites·7 claims
- 0851US2023112020A1Preform solder and bonding method using sameSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 0949US7969028B2Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor devicePANASONIC CORP·Filed 2008·Granted Jun 28, 2011·0 cites·7 claims
- 1039US2022402057A1Magnetic-field melting solder, and joining method in which same is usedSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →