Inventor · disambiguated record
Yinhua Cui
Also filed as: Cui Yinhua
2 granted patents·3 pending applications·0 citations·filing 2021–2025
22Inventor score
Technology areasH10W
Files withINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES4SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD1
Top patents by PatentIndex Score
5 records- 0153US2024153913A13d stacked packaging structure and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0244US11869872B2Chip stack packaging structure and chip stack packaging methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Jan 9, 2024·0 cites·19 claims
- 0343US12112956B2Chip interconnection package structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 0442US2022375892A1Chip packaging method and chip packaging structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 0541US2025174565A1Embedded three-dimensional fan-out package structure and preparation method thereofSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →