Inventor · disambiguated record
Yunzhi Ling
Also filed as: LING YUNZHI
4 granted patents·5 pending applications·0 citations·filing 2021–2025
51Inventor score
Technology areasH10W
Files withINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES7SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD2
Top patents by PatentIndex Score
9 records- 0156US12506252B2Fan-out package structure and fabrication method thereforINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0251US2024304556A1Chiplet-fine-interconnection-package structure and method of manufacturing the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0348US2024186254A1Carrier structure suitable for chiplet fine line and manufacturing method thereof, and fine line chiplet packaging structure and manufacturing method of the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0448US2025246533A1Fan-out package structure with inter-chip fine internal interconnection line and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Application pending·0 cites
- 0547US12266623B2Substrate bonding methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 0644US11869872B2Chip stack packaging structure and chip stack packaging methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Jan 9, 2024·0 cites·19 claims
- 0743US12112956B2Chip interconnection package structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 0842US2022375892A1Chip packaging method and chip packaging structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 0941US2025174565A1Embedded three-dimensional fan-out package structure and preparation method thereofSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →