Inventor · disambiguated record
Byung-In Kwon
Also filed as: KWON BYUNG-IN
8 granted patents·3 pending applications·9 citations·filing 1996–2020
75Inventor score
Top patents by PatentIndex Score
11 records- 0154US11079690B2Apparatus and method for processing a substrate using the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·10 claims
- 0249US11693307B2Reticle pod for preventing haze contamination and reticle stocker having the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted Jul 4, 2023·0 cites·17 claims
- 0348US2021208516A1Reticle stage for preventing haze contamination and exposure apparatus having the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2020·Application pending·0 cites
- 0446US11605550B2Alignment systemXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted Mar 14, 2023·0 cites·18 claims
- 0545US11340523B2Correction method of photomask patternXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted May 24, 2022·0 cites·10 claims
- 0643US11779871B2Exhaust module for wafer baking apparatus and wafer processing system having the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted Oct 10, 2023·0 cites·17 claims
- 0740US2021125843A1Air control cabinet module and clean room system having the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Application pending·0 cites
- 0838US11342184B2Method of forming multiple patterned layers on wafer and exposure apparatus thereofXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted May 24, 2022·0 cites·12 claims
- 0938US2020194297A1Track system and method of processing semiconductor wafersXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Application pending·0 cites
- 1031US5844672AMethod for comparing lens distortion between two steppersHYUNDAI ELECTRONICS IND·Filed 1997·Granted Dec 1, 1998·4 cites·1 claims
- 1131US5804514AMethod of planarizing a film of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted Sep 8, 1998·5 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →