Inventor · disambiguated record
Colin T. Carver
Also filed as: CARVER COLIN · CARVER COLIN T
15 granted patents·3 pending applications·31 citations·filing 2013–2025
89Inventor score
Top patents by PatentIndex Score
18 records- 0193US9997457B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2013·Granted Jun 12, 2018·12 cites·18 claims
- 0291US9165824B2Interconnects with fully clad linesINTEL CORP·Filed 2013·Granted Oct 20, 2015·11 cites·19 claims
- 0386US10700007B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·22 claims
- 0485US12354956B2Cobalt based interconnects and methods of fabrication thereofTAHOE RES LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0580US11289421B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 0678US11862563B2Cobalt based interconnects and methods of fabrication thereofTAHOE RES LTD·Filed 2022·Granted Jan 2, 2024·0 cites·22 claims
- 0772US11594452B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2020·Granted Feb 28, 2023·0 cites·24 claims
- 0872US11328993B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2020·Granted May 10, 2022·0 cites·10 claims
- 0970US11784123B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 1069US10490449B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2015·Granted Nov 26, 2019·1 cites·9 claims
- 1168US10546772B2Self-aligned via below subtractively patterned interconnectINTEL CORP·Filed 2016·Granted Jan 28, 2020·1 cites·20 claims
- 1265US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 1365US9385085B2Interconnects with fully clad linesINTEL CORP·Filed 2015·Granted Jul 5, 2016·1 cites·17 claims
- 1465US2025251662A1Radical scavenger additives for metal oxide based resists and precursor solutionsINPRIA CORP·Filed 2025·Application pending·0 cites
- 1564US10896847B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2019·Granted Jan 19, 2021·0 cites·14 claims
- 1655US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 1754US2024088701A1Current and heat balancing constant voltage chargingINTEL CORP·Filed 2022·Application pending·0 cites
- 1848US2022199516A1Metal lines patterned by bottom-up fill metallization for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →