Inventor · disambiguated record
Chih Pang Ma
Also filed as: MA CHIH PANG
9 granted patents·4 pending applications·24 citations·filing 2006–2018
82Inventor score
Files withADVANCED OPTOELECTRONIC TECH7HUNG TZU-CHIEN2FOXSEMICON INTEGRATED TECH INC1HONG TZU CHIEN1HUANG SHIH-CHENG1
Top patents by PatentIndex Score
13 records- 0180US7683381B2Semiconductor light-emitting deviceADVANCED OPTOELECTRONIC TECH·Filed 2008·Granted Mar 23, 2010·8 cites·19 claims
- 0280US7586129B2Single chip with multi-LEDADVANCED OPTOELECTRONIC TECH·Filed 2006·Granted Sep 8, 2009·9 cites·14 claims
- 0377US9082934B2Semiconductor optoelectronic structure with increased light extraction efficiencyADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jul 14, 2015·2 cites·14 claims
- 0470US8535958B2Method for fabricating light emitting diodeHUNG TZU-CHIEN·Filed 2012·Granted Sep 17, 2013·1 cites·6 claims
- 0569US8574939B2Semiconductor optoelectronics structure with increased light extraction efficiency and fabrication method thereofHUANG SHIH CHENG·Filed 2010·Granted Nov 5, 2013·1 cites·13 claims
- 0662US8278645B2Light emitting diode and fabrication thereofHONG TZU CHIEN·Filed 2009·Granted Oct 2, 2012·3 cites·7 claims
- 0747US7994515B2Light emitting device with high light extraction efficiencyFOXSEMICON INTEGRATED TECH INC·Filed 2008·Granted Aug 9, 2011·0 cites·4 claims
- 0843US11063184B2Light emitting diode and fabrication method thereofXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·20 claims
- 0940US8253146B2LED die having heat dissipation layersHUNG TZU-CHIEN·Filed 2010·Granted Aug 28, 2012·0 cites·13 claims
- 1040US2011073872A1High brightness light emitting diode and manufacturing method thereofADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
- 1140US2010224900A1Semiconductor optoelectronic device and method for making the sameADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
- 1240US2010224897A1Semiconductor optoelectronic device and method for forming the sameADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
- 1334US2010261300A1Method for separating substrate from semiconductor layerADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →