Inventor · disambiguated record
Paul Ho
Also filed as: HO PAUL · HO PAUL K K · HO PAUL KWOK KEUNG
33 granted patents·6 pending applications·708 citations·filing 1998–2018
97Inventor score
Top patents by PatentIndex Score
39 records- 0194US10290432B1Method for forming perovskite solar cell with printable carbon electrodeNANO & ADVANCED MATERIALS INST LTD·Filed 2018·Granted May 14, 2019·22 cites·20 claims
- 0294US6683002B1Method to create a copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 27, 2004·71 cites·7 claims
- 0390US6184138B1Method to create a controllable and reproducible dual copper damascene structureCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Feb 6, 2001·121 cites·13 claims
- 0489US6274499B1Method to avoid copper contamination during copper etching and CMPCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Aug 14, 2001·98 cites·30 claims
- 0587US6225221B1Method to deposit a copper seed layer for dual damascene interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 1, 2001·53 cites·20 claims
- 0684US6720204B2Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Apr 13, 2004·38 cites·18 claims
- 0782US6251786B1Method to create a copper dual damascene structure with less dishing and erosionCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Jun 26, 2001·65 cites·20 claims
- 0880US6475810B1Method of manufacturing embedded organic stop layer for dual damascene patterningCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Nov 5, 2002·24 cites·24 claims
- 0978US6540841B1Method and apparatus for removing contaminants from the perimeter of a semiconductor substrateCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 1, 2003·13 cites·12 claims
- 1078US6429117B1Method to create copper traps by modifying treatment on the dielectrics surfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·21 cites·34 claims
- 1177US6255266B1Alkyldione peroxides as cleaning solutions for wafer fabsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 3, 2001·9 cites·7 claims
- 1274US6340608B1Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper padsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 22, 2002·21 cites·11 claims
- 1372US6350689B1Method to remove copper contamination by using downstream oxygen and chelating agent plasmaCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 26, 2002·15 cites·40 claims
- 1472US6261954B1Method to deposit a copper layerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 17, 2001·12 cites·17 claims
- 1570US6017826AChlorine containing plasma etch method with enhanced sidewall passivation and attenuated microloading effectCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Jan 25, 2000·38 cites·13 claims
- 1663US6813796B2Apparatus and methods to clean copper contamination on wafer edgeCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Nov 9, 2004·4 cites·5 claims
- 1763US6365508B1Process without post-etch cleaning-converting polymer and by-products into an inert layerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 2, 2002·11 cites·20 claims
- 1862US6987321B2Copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Jan 17, 2006·7 cites·20 claims
- 1961US6261955B1Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processesCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 17, 2001·6 cites·16 claims
- 2060US6394114B1Method for stripping copper in damascene interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted May 28, 2002·20 cites·8 claims
- 2159US6391783B1Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly techniqueCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 21, 2002·6 cites·22 claims
- 2259US6309982B1Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agentCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Oct 30, 2001·6 cites·19 claims
- 2356US6967162B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Nov 22, 2005·4 cites·7 claims
- 2456US6692579B2Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequenceCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 17, 2004·5 cites·7 claims
- 2556US6368958B2Method to deposit a cooper seed layer for dual damascence interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Apr 9, 2002·4 cites·14 claims
- 2656US6358821B1Method of copper transport prevention by a sputtered gettering layer on backside of waferCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 19, 2002·5 cites·41 claims
- 2751US9243340B2Non-vacuum method of manufacturing light-absorbing materials for solar cell applicationNANO & ADVANCED MATERIALS INST LTD·Filed 2014·Granted Jan 26, 2016·0 cites·9 claims
- 2848US9583711B2Conductive and photosensitive polymersNANO & ADVANCED MATERIALS INST LTD·Filed 2014·Granted Feb 28, 2017·0 cites·10 claims
- 2945US6565664B2Method for stripping copper in damascene interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted May 20, 2003·1 cites·9 claims
- 3045US2005224921A1Method for bonding wafers to produce stacked integrated circuitsGUPTA SUBHASH·Filed 2005·Application pending·0 cites
- 3144US7452808B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Nov 18, 2008·0 cites·6 claims
- 3244US7060613B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Jun 13, 2006·0 cites·4 claims
- 3344US2005205522A1Chemical agent additives in copper CMP slurryCHARTERED SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3440US2002048950A1Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processesCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 3538US2002163072A1Method for bonding wafers to produce stacked integrated circuitsFiled 2001·Application pending·0 cites
- 3636US6132521ACleaning metal surfaces with alkyldione peroxidesCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Oct 17, 2000·4 cites·11 claims
- 3736US2002115283A1Planarization by selective electro-dissolutionCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 3836US2020027625A1Transparent conductive film and themethod of making the sameNANO & ADVANCED MATERIALS INST LTD·Filed 2018·Application pending·0 cites
- 3924US6548413B1Method to reduce microloading in metal etchingCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Apr 15, 2003·4 cites·20 claims
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