Inventor · disambiguated record
Etuo Egashira
Also filed as: EGASHIRA ETUO
4 granted patents·63 citations·filing 1986–2000
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0161US4783225AWafer and method of working the sameHITACHI LTD·Filed 1986·Granted Nov 8, 1988·27 cites·13 claims
- 0251US5230747AWafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the waferHITACHI LTD·Filed 1991·Granted Jul 27, 1993·17 cites·3 claims
- 0349US5279992AMethod of producing a wafer having a curved notchHITACHI LTD·Filed 1992·Granted Jan 18, 1994·18 cites·4 claims
- 0444USRE40139EWafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the waferRENESAS TECH CORP·Filed 2000·Granted Mar 4, 2008·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →