Inventor · disambiguated record
Jyun-Ru Wu
Also filed as: WU JYUN-RU
6 granted patents·2 citations·filing 2012–2019
72Inventor score
Top patents by PatentIndex Score
6 records- 0177US9224773B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameCHANG SHIH-CHIEH·Filed 2012·Granted Dec 29, 2015·1 cites·20 claims
- 0272US11018176B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 0370US9620555B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·20 claims
- 0468US10749278B2Method of electroplating metal into recessed feature and electroplating layer in recessed featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 18, 2020·0 cites·20 claims
- 0557US10276621B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 0655US10879629B2Method of electroplating metal into recessed feature and electroplating layer in recessed featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →