Inventor · disambiguated record
Hongsik Shin
Also filed as: SHIN Hongsik
9 granted patents·6 pending applications·5 citations·filing 2015–2024
78Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0180US12148701B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Nov 19, 2024·0 cites·17 claims
- 0279US11031340B2Semiconductor device including a multilayer etch stop layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 8, 2021·2 cites·5 claims
- 0374US9536983B2Methods of manufacturing semiconductor devices including gate patterns with sidewall spacers and capping patterns on the sidewall spacersSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 3, 2017·3 cites·19 claims
- 0467US11948888B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·10 claims
- 0561US12034060B2Semiconductor device having a ring-shaped protection spacer above a contact pad and enclosing a source/drain contact plugSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·19 claims
- 0654US12284821B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0752US11362196B2Semiconductor device having a ring-shaped protection spacer enclosing a source/drain contact plugSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·10 claims
- 0850US12068242B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 0950US12021146B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 1050US2024312914A1Semiconductor device with lower contact and lower power structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1149US2025203929A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1249US2024243064A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1347US2023335606A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1447US2023352547A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1545US2024347424A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →