Inventor · disambiguated record
Fumio Ohara
Also filed as: OHARA FUMIO
9 granted patents·1,153 citations·filing 1991–2007
92Inventor score
Top patents by PatentIndex Score
9 records- 0197US6555901B1Semiconductor device including eutectic bonding portion and method for manufacturing the sameDENSO CORP·Filed 1997·Granted Apr 29, 2003·380 cites·7 claims
- 0294US6072240ASemiconductor chip packageDENSO CORP·Filed 1998·Granted Jun 6, 2000·170 cites·29 claims
- 0394US5824177AMethod for manufacturing a semiconductor deviceNIPPON DENSO CO·Filed 1996·Granted Oct 20, 1998·184 cites·17 claims
- 0494US5668033AMethod for manufacturing a semiconductor acceleration sensor deviceNIPPON DENSO CO·Filed 1996·Granted Sep 16, 1997·301 cites·20 claims
- 0593US6448645B1Semiconductor deviceDENSO CORP·Filed 2000·Granted Sep 10, 2002·77 cites·17 claims
- 0660US7556510B2Mounting structure of connector and method for mounting connector on substrateDENSO CORP·Filed 2007·Granted Jul 7, 2009·7 cites·41 claims
- 0755US5470618AMethod of making zinc-based transparent conductive filmNIPPON SOKEN·Filed 1994·Granted Nov 28, 1995·16 cites·7 claims
- 0837US5483097ADevice protecting layerNIPPON DENSO CO·Filed 1994·Granted Jan 9, 1996·10 cites·7 claims
- 0935US5153700ACrystal-etched matching faces on semiconductor chip and supporting semiconductor substrateNIPPON DENSO CO·Filed 1991·Granted Oct 6, 1992·8 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →