Inventor · disambiguated record
Clemens Fitz
Also filed as: FITZ CLEMENS · FITZ CLEMENS CHRISTOF STEFAN
18 granted patents·8 pending applications·17 citations·filing 2006–2021
89Inventor score
Top patents by PatentIndex Score
26 records- 0186US8518765B1Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residuesDUONG ANH·Filed 2012·Granted Aug 27, 2013·5 cites·18 claims
- 0273US8293605B2Methods for fabricating a CMOS integrated circuit having a dual stress layer (DSL)BAARS PETER·Filed 2011·Granted Oct 23, 2012·3 cites·14 claims
- 0369US8906794B1Gate silicidationGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 9, 2014·2 cites·11 claims
- 0466US8008729B2Integrated circuit with a contact structure including a portion arranged in a cavity of a semiconductor structureQIMONDA AG·Filed 2008·Granted Aug 30, 2011·3 cites·20 claims
- 0564US8513117B2Process to remove Ni and Pt residues for NiPtSi applicationsDUONG ANH·Filed 2011·Granted Aug 20, 2013·2 cites·20 claims
- 0661US9399753B2Aqua regia and hydrogen peroxide HCL combination to remove Ni and NiPt residuesINTERMOLECULAR INC·Filed 2014·Granted Jul 26, 2016·0 cites·13 claims
- 0759US8946015B2Aqua regia and hydrogen peroxide HCI combination to remove Ni and NiPt residuesINTERMOLECULAR INC·Filed 2014·Granted Feb 3, 2015·0 cites·20 claims
- 0858US8809140B2Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residuesINTERMOLECULAR INC·Filed 2013·Granted Aug 19, 2014·0 cites·19 claims
- 0957US7678654B2Buried bitline with reduced resistanceQIMONDA AG·Filed 2006·Granted Mar 16, 2010·2 cites·7 claims
- 1056US11929290B2Method of manufacturing microelectronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Mar 12, 2024·0 cites·14 claims
- 1154US9034746B2Gate silicidationGLOBALFOUNDRIES INC·Filed 2014·Granted May 19, 2015·0 cites·12 claims
- 1242US8859408B2Stabilized metal silicides in silicon-germanium regions of transistor elementsFLACHOWSKY STEFAN·Filed 2011·Granted Oct 14, 2014·0 cites·17 claims
- 1341US8815736B2Methods of forming metal silicide regions on semiconductor devices using different temperaturesSCHEIPER THILO·Filed 2011·Granted Aug 26, 2014·0 cites·14 claims
- 1441US7679149B2Method of removing refractory metal layers and of siliciding contact areasQIMONDA AG·Filed 2007·Granted Mar 16, 2010·0 cites·12 claims
- 1541US2015017456A1Reducing voids caused by trapped acid on a dielectric surfaceINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 1639US8765586B2Methods of forming metal silicide regions on semiconductor devicesFITZ CLEMENS·Filed 2011·Granted Jul 1, 2014·0 cites·19 claims
- 1738US2009236682A1Layer stack including a tungsten layerBOUBEKEUR HOCINE·Filed 2008·Application pending·0 cites
- 1838US2019043963A1Transistor element with gate electrode of reduced height and raised drain and source regions and method of fabricating the sameGLOBALFOUNDRIES INC·Filed 2017·Application pending·0 cites
- 1938US2014248770A1Microwave-assisted heating of strong acid solution to remove nickel platinum/platinum residuesGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 2036US8835298B2NiSi rework procedure to remove platinum residualsKUMARASAMY SIVAKUMAR·Filed 2012·Granted Sep 16, 2014·0 cites·20 claims
- 2135US2018138285A1Methods of forming integrated circuit structure with silicide reigonGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
- 2234US8835318B2HNO3 single wafer clean process to strip nickel and for MOL post etchFITZ CLEMENS·Filed 2012·Granted Sep 16, 2014·0 cites·12 claims
- 2334US2009057810A1Method of Fabricating an Integrated CircuitVERDUGO VICTOR·Filed 2007·Application pending·0 cites
- 2432US2008124920A1Fabrication method for an integrated circuit structureFITZ CLEMENS·Filed 2007·Application pending·0 cites
- 2529US2013049124A1Mosfet integrated circuit with improved silicide thickness uniformity and methods for its manufactureFITZ CLEMENS·Filed 2011·Application pending·0 cites
- 2626US8761489B2Method and apparatus for characterizing discontinuities in semiconductor devicesRINDERKNECHT JOCHEN·Filed 2011·Granted Jun 24, 2014·0 cites·18 claims
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