Inventor · disambiguated record
Daisuke Souma
Also filed as: SOUMA DAISUKE
6 granted patents·1 pending application·46 citations·filing 2004–2023
78Inventor score
Top patents by PatentIndex Score
7 records- 0184US11495566B2Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2021·Granted Nov 8, 2022·1 cites·7 claims
- 0284US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0369US8434614B2Storing package unit and a storing method for micro solder spheresSATO ISAMU·Filed 2009·Granted May 7, 2013·6 cites·12 claims
- 0469US2024100635A1Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2023·Application pending·0 cites
- 0559US11872656B2Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2020·Granted Jan 16, 2024·0 cites·4 claims
- 0656US7750475B2Lead-free solder ballSENJU METAL INDUSTRY CO·Filed 2004·Granted Jul 6, 2010·7 cites·8 claims
- 0755US11478869B2Method for forming bump electrode substrateSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 25, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →