Inventor · disambiguated record
Emanuel I. Cooper
Also filed as: COOPER EMANUEL · COOPER EMANUEL I · COOPER EMANUEL ISRAEL · VEREECKEN PHILIPPE M
72 granted patents·20 pending applications·810 citations·filing 1984–2023
99Inventor score
Top patents by PatentIndex Score
92 records- 0196US7112851B2Field effect transistor with electroplated metal gateIBM·Filed 2005·Granted Sep 26, 2006·36 cites·20 claims
- 0292US5392177ASealed DASD having humidity control and method of making sameIBM·Filed 1994·Granted Feb 21, 1995·58 cites·31 claims
- 0391US11365351B2Wet etching composition and methodENTEGRIS INC·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0491US8026200B2Low pH mixtures for the removal of high density implanted resistADVANCED TECH MATERIALS·Filed 2009·Granted Sep 27, 2011·19 cites·26 claims
- 0590US9831088B2Composition and process for selectively etching metal nitridesCHEN TIANNIU·Filed 2011·Granted Nov 28, 2017·15 cites·12 claims
- 0690US9546321B2Compositions and methods for selectively etching titanium nitrideBARNES JEFFREY A·Filed 2012·Granted Jan 17, 2017·11 cites·20 claims
- 0790US8778210B2Compositions and methods for the selective removal of silicon nitrideCOOPER EMANUEL I·Filed 2007·Granted Jul 15, 2014·26 cites·17 claims
- 0890US8685909B2Antioxidants for post-CMP cleaning formulationsANGST DAVID·Filed 2009·Granted Apr 1, 2014·22 cites·19 claims
- 0990US8618036B2Aqueous cerium-containing solution having an extended bath lifetime for removing mask materialAFZALI-ARDAKANI ALI·Filed 2011·Granted Dec 31, 2013·11 cites·23 claims
- 1090US8367555B2Removal of masking materialIBM·Filed 2009·Granted Feb 5, 2013·15 cites·38 claims
- 1190US6967131B2Field effect transistor with electroplated metal gateIBM·Filed 2003·Granted Nov 22, 2005·43 cites·22 claims
- 1289US10138117B2Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibilityENTEGRIS INC·Filed 2014·Granted Nov 27, 2018·10 cites·15 claims
- 1388US10176979B2Post-CMP removal using compositions and method of useENTEGRIS INC·Filed 2013·Granted Jan 8, 2019·10 cites·21 claims
- 1488US7868410B2Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flowIBM·Filed 2008·Granted Jan 11, 2011·13 cites·7 claims
- 1587US11053440B2Silicon nitride etching composition and methodENTEGRIS INC·Filed 2019·Granted Jul 6, 2021·3 cites·20 claims
- 1686US10392560B2Compositions and methods for selectively etching titanium nitrideENTEGRIS INC·Filed 2017·Granted Aug 27, 2019·4 cites·17 claims
- 1786US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 1885US9416338B2Composition for and method of suppressing titanium nitride corrosionCOOPER EMANUEL I·Filed 2011·Granted Aug 16, 2016·10 cites·17 claims
- 1985US7537709B2Method for isotropic etching of copperIBM·Filed 2006·Granted May 26, 2009·9 cites·12 claims
- 2085US7368045B2Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flowIBM·Filed 2005·Granted May 6, 2008·10 cites·39 claims
- 2185US7217655B2Electroplated CoWP composite structures as copper barrier layersIBM·Filed 2005·Granted May 15, 2007·11 cites·25 claims
- 2284US9528078B2Antioxidants for post-CMP cleaning formulationsADVANCED TECH MATERIALS·Filed 2014·Granted Dec 27, 2016·4 cites·20 claims
- 2384US7056648B2Method for isotropic etching of copperIBM·Filed 2003·Granted Jun 6, 2006·29 cites·15 claims
- 2483USRE46427EAntioxidants for post-CMP cleaning formulationsADVANCED TECH MATERIALS·Filed 2015·Granted Jun 6, 2017·2 cites·19 claims
- 2583US7736474B2Plating apparatus and plating methodEBARA CORP·Filed 2005·Granted Jun 15, 2010·8 cites·4 claims
- 2683US7060624B2Deep filled viasIBM·Filed 2003·Granted Jun 13, 2006·28 cites·16 claims
- 2783US6855240B2CoFe alloy film and process of making sameHITACHI GLOBAL STORAGE TECH·Filed 2003·Granted Feb 15, 2005·21 cites·17 claims
- 2882US9691629B2Compositions and methods for the selective removal of silicon nitrideENTEGRIS INC·Filed 2015·Granted Jun 27, 2017·3 cites·11 claims
- 2981US10651045B2Compositions and methods for etching silicon nitride-containing substratesENTEGRIS INC·Filed 2018·Granted May 12, 2020·3 cites·20 claims
- 3081US9520617B2Sulfolane mixtures as ambient aprotic polar solventsADVANCED TECH MATERIALS·Filed 2014·Granted Dec 13, 2016·2 cites·10 claims
- 3177US10472567B2Compositions and methods for selectively etching titanium nitrideENTEGRIS INC·Filed 2014·Granted Nov 12, 2019·4 cites·14 claims
- 3276US5962384AMethod for cleaning semiconductor devicesIBM·Filed 1997·Granted Oct 5, 1999·40 cites·9 claims
- 3375US10460954B2Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibilityENTEGRIS INC·Filed 2015·Granted Oct 29, 2019·2 cites·18 claims
- 3475US10428271B2Compositions and methods for selectively etching titanium nitrideENTEGRIS INC·Filed 2014·Granted Oct 1, 2019·3 cites·16 claims
- 3574US11978622B2Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibilityENTEGRIS INC·Filed 2015·Granted May 7, 2024·2 cites·13 claims
- 3674US11697767B2Silicon nitride etching composition and methodENTEGRIS INC·Filed 2021·Granted Jul 11, 2023·0 cites·9 claims
- 3773US9158203B2Compositions and methods for the selective removal of silicon nitrideADVANCED TECH MATERIALS·Filed 2014·Granted Oct 13, 2015·2 cites·19 claims
- 3873US6613602B2Method and system for forming a thermoelement for a thermoelectric coolerIBM·Filed 2001·Granted Sep 2, 2003·30 cites·22 claims
- 3973US2023295502A1Silicon nitride etching composition and methodENTEGRIS INC·Filed 2023·Application pending·0 cites
- 4069US5866044ALead free conductive composites for electrical interconnectionsIBM·Filed 1996·Granted Feb 2, 1999·32 cites·4 claims
- 4169US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 4268US11781066B2Wet etching composition and methodENTEGRIS INC·Filed 2022·Granted Oct 10, 2023·0 cites·14 claims
- 4368US7976723B2Method for kinetically controlled etching of copperIBM·Filed 2007·Granted Jul 12, 2011·2 cites·21 claims
- 4467US10957547B2Formulations to selectively etch silicon germanium relative to germaniumENTEGRIS INC·Filed 2016·Granted Mar 23, 2021·1 cites·18 claims
- 4567US10475658B2Formulations to selectively etch silicon and germaniumENTEGRIS INC·Filed 2014·Granted Nov 12, 2019·1 cites·11 claims
- 4667US7193323B2Electroplated CoWP composite structures as copper barrier layersIBM·Filed 2003·Granted Mar 20, 2007·11 cites·18 claims
- 4765US9929014B2Dopant precursors for mono-layer dopingENTEGRIS INC·Filed 2014·Granted Mar 27, 2018·1 cites·18 claims
- 4864US5545429AFabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocessIBM·Filed 1994·Granted Aug 13, 1996·25 cites·47 claims
- 4964US2017096624A1New antioxidants for post-cmp cleaning formulationsADVANCED TECH MATERIALS·Filed 2016·Application pending·0 cites
- 5063US2023030323A1Method and composition for etching molybdenumENTEGRIS INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 92 patent records by PatentIndex Score.
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