Inventor · disambiguated record
Ken Tachibana
Also filed as: TACHIBANA KEN
15 granted patents·7 pending applications·124 citations·filing 1998–2024
91Inventor score
Top patents by PatentIndex Score
22 records- 0191US6112716AFuel injection control system for internal combustion engine of cylinder injection typeMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Sep 5, 2000·65 cites·6 claims
- 0281US2024363571A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0379US9402321B2Soldering method using a low-temperature solder pasteSENJU METAL INDUSTRY CO·Filed 2012·Granted Jul 26, 2016·4 cites·6 claims
- 0477US6957136B2Apparatus for rewriting a memory in a vehicle mounted ECU through communicationsMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Oct 18, 2005·28 cites·10 claims
- 0576US9527167B2Lead-free solder ballOHNISHI TSUKASA·Filed 2012·Granted Dec 27, 2016·4 cites·13 claims
- 0675US9780055B2Lead-free solder ballYAMANAKA YOSHIE·Filed 2012·Granted Oct 3, 2017·4 cites·11 claims
- 0775US9700963B2Lead-free solder ballSENJU METAL INDUSTRY CO·Filed 2016·Granted Jul 11, 2017·2 cites·14 claims
- 0872US9837757B2Lead-free solder alloy and in-vehicle electronic circuitSENJU METAL INDUSTRY CO·Filed 2014·Granted Dec 5, 2017·2 cites·19 claims
- 0970US10343238B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2017·Granted Jul 9, 2019·1 cites·12 claims
- 1069US10500680B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2017·Granted Dec 10, 2019·1 cites·16 claims
- 1167US7210452B2Control apparatus of internal combustion engineMITSUBISHI ELECTRIC CORP·Filed 2005·Granted May 1, 2007·7 cites·13 claims
- 1260US10434608B2Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder jointSENJU METAL INDUSTRY CO·Filed 2014·Granted Oct 8, 2019·2 cites·16 claims
- 1356US2019088611A1"Lead-Free Solder Ball"SENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1453US2018005970A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2017·Application pending·0 cites
- 1553US2015328722A1Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2012·Application pending·0 cites
- 1652US2015037087A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
- 1750US10076808B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Sep 18, 2018·0 cites·7 claims
- 1850US2019076966A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1949US6945208B2Start control apparatus of internal combustion engineMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 20, 2005·4 cites·7 claims
- 2048US11465244B2Solder alloy, solder ball, chip solder, solder paste and solder jointSENJU METAL INDUSTRY CO·Filed 2016·Granted Oct 11, 2022·0 cites·7 claims
- 2143US10773345B2Solder alloy, solder ball, chip solder, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2017·Granted Sep 15, 2020·0 cites·8 claims
- 2240US2016074971A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
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