Inventor · disambiguated record
Yu-Pin Tsai
Also filed as: TSAI YU-PEN · TSAI YU-PIN
17 granted patents·8 pending applications·135 citations·filing 2002–2023
92Inventor score
Top patents by PatentIndex Score
25 records- 0194US10037975B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 31, 2018·42 cites·18 claims
- 0292US7842597B2Chip package, chip packaging, chip carrier and process thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Nov 30, 2010·32 cites·23 claims
- 0391US7560818B2Stacked structure of chips and water structure for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jul 14, 2009·25 cites·7 claims
- 0490US11133423B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·6 cites·18 claims
- 0583US10269771B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 0682US11508668B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·1 cites·11 claims
- 0779US12506103B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 23, 2025·0 cites·19 claims
- 0874US6691876B2Semiconductor wafer cassetteADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Feb 17, 2004·21 cites·6 claims
- 0973US11935841B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Mar 19, 2024·0 cites·15 claims
- 1073US9564376B2Semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 7, 2017·3 cites·19 claims
- 1172US11121111B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 14, 2021·1 cites·18 claims
- 1264US11764311B2Optical device and electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 1356US10879215B2Method for manufacturing a semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
- 1452US2025183099A1Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1549US10395997B2Semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 27, 2019·0 cites·20 claims
- 1647US2008132000A1Chip scale package and method for marking chip scale packagesADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1742US7510909B2Fabricating method of wafer protection layersADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 31, 2009·0 cites·13 claims
- 1842US2007155049A1Method for Manufacturing Chip Package StructuresADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1941US11088057B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 10, 2021·0 cites·18 claims
- 2039US2008200037A1Method of thinning a waferTSAI YU-PIN·Filed 2007·Application pending·0 cites
- 2136US2011241194A1Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 2235US2010001416A1Wafer laser-marking method and die fabricated using the sameTSAI YU-PIN·Filed 2009·Application pending·0 cites
- 2335US2004188860A1Chip scale package and method for marking the sameFiled 2004·Application pending·0 cites
- 2433US2006256222A1CIS Package and Method ThereofTSAI YU-PIN·Filed 2005·Application pending·0 cites
- 2528US8728915B2Wafer laser-making method and die fabricated using the sameTSAI YU-PIN·Filed 2011·Granted May 20, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →