Inventor · disambiguated record
Yi-Chian Liao
Also filed as: LIAO YI-CHIAN
7 granted patents·2 pending applications·3 citations·filing 2010–2020
72Inventor score
Top patents by PatentIndex Score
9 records- 0186US11164755B1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Nov 2, 2021·2 cites·13 claims
- 0264US9087780B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 21, 2015·1 cites·8 claims
- 0350US9257381B2Semiconductor package, and interposer structure of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 9, 2016·0 cites·9 claims
- 0449US9418874B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·9 claims
- 0548US11418002B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·20 claims
- 0648US9548220B2Method of fabricating semiconductor package having an interposer structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 17, 2017·0 cites·14 claims
- 0748US2011159445A1Method for Making a Texture on a Transparent Conductive Film of a Solar CellCHUNG SHAN INST OF SCIENCE·Filed 2010·Application pending·0 cites
- 0844US8829687B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Sep 9, 2014·0 cites·18 claims
- 0938US2014077387A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →