Inventor · disambiguated record
Lai Nguk Chin
Also filed as: CHIN LAI NGUK
6 granted patents·11 citations·filing 2007–2015
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0172US8357563B2Stitch bump stacking design for overall package size reduction for multiple stackSPANSION LLC·Filed 2010·Granted Jan 22, 2013·5 cites·14 claims
- 0264US9196608B2Method of chip positioning for multi-chip packagingSPANSION LLC·Filed 2014·Granted Nov 24, 2015·2 cites·15 claims
- 0362US7932131B2Reduction of package height in a stacked die configurationSPANSION LLC·Filed 2007·Granted Apr 26, 2011·4 cites·17 claims
- 0445US8901756B2Chip positioning in multi-chip packageSPANSION LLC·Filed 2012·Granted Dec 2, 2014·0 cites·14 claims
- 0535US9679831B2Tape chip on lead using paste die attach materialCYPRESS SEMICONDUCTOR CORP·Filed 2015·Granted Jun 13, 2017·0 cites·8 claims
- 0626US8680686B2Method and system for thin multi chip stack package with film on wire and copper wireCHIN LAI NGUK·Filed 2010·Granted Mar 25, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →