Inventor · disambiguated record
Sally Foong
Also filed as: FOONG SALLY · FOONG SALLY Y · FOONG SALLY Y L · FOONG SALLY YIN LYE
17 granted patents·1 pending application·61 citations·filing 2000–2015
91Inventor score
Files withSPANSION LLC9ADVANCED MICRO DEVICES INC5CYPRESS SEMICONDUCTOR CORP2CHIN LAI NGUK1TAN GIN GHEE1
Top patents by PatentIndex Score
18 records- 0172US8357563B2Stitch bump stacking design for overall package size reduction for multiple stackSPANSION LLC·Filed 2010·Granted Jan 22, 2013·5 cites·14 claims
- 0267US6337225B1Method of making stacked die assemblies and modulesADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 8, 2002·19 cites·20 claims
- 0364US9196608B2Method of chip positioning for multi-chip packagingSPANSION LLC·Filed 2014·Granted Nov 24, 2015·2 cites·15 claims
- 0462US7932131B2Reduction of package height in a stacked die configurationSPANSION LLC·Filed 2007·Granted Apr 26, 2011·4 cites·17 claims
- 0561US7674653B2Die offset die to bondingSPANSION LLC·Filed 2008·Granted Mar 9, 2010·2 cites·3 claims
- 0660US9431364B2Multi-chip package assembly with improved bond wire separationCYPRESS SEMICONDUCTOR CORP·Filed 2013·Granted Aug 30, 2016·3 cites·15 claims
- 0757US8791007B2Device having multiple wire bonds for a bond area and methods thereofTAN GIN GHEE·Filed 2011·Granted Jul 29, 2014·2 cites·15 claims
- 0856US6383843B1Using removable spacers to ensure adequate bondline thicknessADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·8 cites·9 claims
- 0955US6344161B1Device encapsulation process utilizing pre-cut slots in flexible film substrateADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 5, 2002·10 cites·19 claims
- 1051US6547121B2Mechanical clamper for heated substrates at die attachADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 15, 2003·4 cites·10 claims
- 1149US7750481B2Die offset die to die bondingSPANSION LLC·Filed 2008·Granted Jul 6, 2010·0 cites·5 claims
- 1246US7554204B2Die offset die to die bondingSPANSION LLC·Filed 2007·Granted Jun 30, 2009·0 cites·8 claims
- 1345US8901756B2Chip positioning in multi-chip packageSPANSION LLC·Filed 2012·Granted Dec 2, 2014·0 cites·14 claims
- 1441US7157376B1Method and apparatus for handling thin semiconductor wafersADVANCED MICRO DEVICES INC·Filed 2004·Granted Jan 2, 2007·2 cites·6 claims
- 1535US9679831B2Tape chip on lead using paste die attach materialCYPRESS SEMICONDUCTOR CORP·Filed 2015·Granted Jun 13, 2017·0 cites·8 claims
- 1634US7799612B2Process applying die attach film to singulated dieSPANSION LLC·Filed 2007·Granted Sep 21, 2010·0 cites·16 claims
- 1734US2009001599A1Die attachment, die stacking, and wire embedding using filmSPANSION LLC·Filed 2007·Application pending·0 cites
- 1826US8680686B2Method and system for thin multi chip stack package with film on wire and copper wireCHIN LAI NGUK·Filed 2010·Granted Mar 25, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →