Inventor · disambiguated record
Takatoshi Yamamoto
Also filed as: YAMAMOTO TAKATOSHI
18 granted patents·12 pending applications·325 citations·filing 1990–2013
93Inventor score
Files withSEIKO EPSON CORP14YAMAMOTO TAKATOSHI5HITACHI LTD3SATO MITSURU3HITACHI AUTOMOTIVE SYSTEMS LTD1
Top patents by PatentIndex Score
30 records- 0197US8211259B2Separating method of bonded bodySATO MITSURU·Filed 2008·Granted Jul 3, 2012·45 cites·12 claims
- 0293US5101640AAir conditioning apparatus, heat exchanger for use in the apparatus and apparatus control methodHITACHI LTD·Filed 1990·Granted Apr 7, 1992·99 cites·12 claims
- 0385US7963435B2Method of forming bonded body and bonded bodySEIKO EPSON CORP·Filed 2009·Granted Jun 21, 2011·10 cites·16 claims
- 0483US7981700B2Semiconductor oxidation apparatus and method of producing semiconductor elementRICOH CO LTD·Filed 2006·Granted Jul 19, 2011·11 cites·7 claims
- 0581US7800358B2Noncontact rotation angle sensor, manufacturing method for the same, and throttle valve control device for internal combustion engine having the sameHITACHI LTD·Filed 2006·Granted Sep 21, 2010·10 cites·10 claims
- 0677US7893368B2Weight measurement device, droplet discharge device, and weight measurement methodSEIKO EPSON CORP·Filed 2008·Granted Feb 22, 2011·8 cites·28 claims
- 0776US7980448B2Method of forming bonded body and bonded bodySEIKO EPSON CORP·Filed 2009·Granted Jul 19, 2011·7 cites·16 claims
- 0876US7967185B2Method of forming bonded body and bonded bodySEIKO EPSON CORP·Filed 2009·Granted Jun 28, 2011·8 cites·17 claims
- 0973US8741472B2Electric storage deviceYAMAMOTO TAKATOSHI·Filed 2011·Granted Jun 3, 2014·2 cites·8 claims
- 1071US5156203AAir conditioning systemHITACHI LTD·Filed 1991·Granted Oct 20, 1992·116 cites·29 claims
- 1169US8517519B2Liquid droplet ejection head and liquid droplet ejection apparatusSATO MITSURU·Filed 2011·Granted Aug 27, 2013·1 cites·21 claims
- 1264US8617340B2Bonding method and bonded bodyYAMAMOTO TAKATOSHI·Filed 2008·Granted Dec 31, 2013·0 cites·13 claims
- 1361US8679283B2Bonding method and bonded bodyYAMAMOTO TAKATOSHI·Filed 2012·Granted Mar 25, 2014·0 cites·16 claims
- 1458US8721044B2Liquid droplet ejection head and liquid droplet ejection apparatusSEIKO EPSON CORP·Filed 2013·Granted May 13, 2014·0 cites·21 claims
- 1558US8016394B2Liquid droplet ejection head and liquid droplet ejection apparatusSEIKO EPSON CORP·Filed 2008·Granted Sep 13, 2011·1 cites·21 claims
- 1656US2010092767A1Bonding method and bonded bodySEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 1751US8816224B2Droplet discharge device including weight measurement deviceYAMAMOTO TAKATOSHI·Filed 2011·Granted Aug 26, 2014·0 cites·5 claims
- 1851US2016240902A1Electricity storage deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2013·Application pending·0 cites
- 1949US8105461B2Method for disassembling bonded structureSATO MITSURU·Filed 2009·Granted Jan 31, 2012·0 cites·10 claims
- 2046US2010206474A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 2146US2010304157A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 2246US2010304156A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 2345US6139643AEffusion cell for Si and molecular beam epitaxy systemNISSIN ELECTRIC CO LTD·Filed 1998·Granted Oct 31, 2000·7 cites·3 claims
- 2445US2009317617A1Base member with binding film, bonding method, and bonded structureSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 2544US2011244283A1Electric Storage Module and Electric Storage DeviceHITACHI VEHICLE ENERGY LTD·Filed 2011·Application pending·0 cites
- 2643US2010092788A1Bonding method and bonded bodySEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 2743US2012058368A1Electrical storage deviceYAMAMOTO TAKATOSHI·Filed 2011·Application pending·0 cites
- 2843US2010218723A1Molecular Beam Cell Having Purge FunctionROHM CO LTD·Filed 2007·Application pending·0 cites
- 2935US2010304159A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 3035US2010302312A1Liquid droplet ejection head and liquid droplet ejection apparatusSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →