Inventor · disambiguated record
Thomas Dory
Also filed as: DORY THOMAS · DORY THOMAS S
43 granted patents·13 pending applications·615 citations·filing 1985–2024
98Inventor score
Files withFUJIFILM ELECTRONIC MAT USA INC30INTEL CORP16OLIN CORP3MUTHUKUMAR SRIRAM2CHRYSLER GREGORY M1
Top patents by PatentIndex Score
56 records- 0196US11407966B2Cleaning compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Aug 9, 2022·3 cites·19 claims
- 0296US10415005B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Sep 17, 2019·7 cites·15 claims
- 0396US9562211B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Feb 7, 2017·15 cites·48 claims
- 0494US11279903B2Cleaning compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Mar 22, 2022·3 cites·53 claims
- 0594US10253282B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Apr 9, 2019·6 cites·43 claims
- 0694US4877641AProcess for plasma depositing silicon nitride and silicon dioxide films onto a substrateOLIN CORP·Filed 1988·Granted Oct 31, 1989·90 cites·24 claims
- 0793US6963483B2Self-aligned coaxial via capacitorsINTEL CORP·Filed 2003·Granted Nov 8, 2005·66 cites·36 claims
- 0892US7183658B2Low cost microelectronic circuit packageINTEL CORP·Filed 2001·Granted Feb 27, 2007·84 cites·47 claims
- 0991US11508569B2Surface treatment compositions and methodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Nov 22, 2022·2 cites·24 claims
- 1091US10490417B2Etching compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2015·Granted Nov 26, 2019·6 cites·16 claims
- 1190US10533146B2Cleaning formulations for removing residues on semiconductor substratesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Jan 14, 2020·6 cites·64 claims
- 1290US9914902B2Stripping compositions for removing photoresists from semiconductor substratesFUJIFILM ELECTRONIC MAT USA INC·Filed 2015·Granted Mar 13, 2018·6 cites·27 claims
- 1390US6565730B2Self-aligned coaxial via capacitorsINTEL CORP·Filed 1999·Granted May 20, 2003·64 cites·12 claims
- 1489US10927329B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Feb 23, 2021·2 cites·15 claims
- 1589US10752867B2Cleaning compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Aug 25, 2020·4 cites·24 claims
- 1689US10696933B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Jun 30, 2020·2 cites·40 claims
- 1789US6614122B1Controlling underfill flow locations on high density packages using physical trenches and damsINTEL CORP·Filed 2000·Granted Sep 2, 2003·86 cites·21 claims
- 1886US7371975B2Electronic packages and components thereof formed by substrate-imprintingINTEL CORP·Filed 2002·Granted May 13, 2008·28 cites·25 claims
- 1985US11639487B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted May 2, 2023·0 cites·29 claims
- 2085US11618867B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Apr 4, 2023·0 cites·30 claims
- 2185US7847394B2Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interfaceINTEL CORP·Filed 2005·Granted Dec 7, 2010·10 cites·7 claims
- 2285US7750441B2Conductive interconnects along the edge of a microelectronic deviceINTEL CORP·Filed 2006·Granted Jul 6, 2010·18 cites·6 claims
- 2384US4877651AProcess for thermally depositing silicon nitride and silicon dioxide films onto a substrateOLIN CORP·Filed 1988·Granted Oct 31, 1989·46 cites·20 claims
- 2482US2022275313A1Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 2581US11401487B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Aug 2, 2022·0 cites·28 claims
- 2681US7704791B2Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interfaceINTEL CORP·Filed 2007·Granted Apr 27, 2010·7 cites·3 claims
- 2777US10619126B2Cleaning compositions and methods of use thereforFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Apr 14, 2020·2 cites·78 claims
- 2876US11286444B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Mar 29, 2022·0 cites·25 claims
- 2975US7545030B2Article having metal impregnated within carbon nanotube arrayINTEL CORP·Filed 2005·Granted Jun 9, 2009·10 cites·26 claims
- 3073US2022306971A1Cleaning CompositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 3170US11898123B2Cleaning compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Feb 13, 2024·0 cites·39 claims
- 3270US9834746B2Cleaning formulations for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Dec 5, 2017·2 cites·21 claims
- 3368US7316061B2Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interfaceINTEL CORP·Filed 2003·Granted Jan 8, 2008·10 cites·24 claims
- 3468US2023048767A1Surface Treatment Compositions and MethodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 3567US12448568B2Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Granted Oct 21, 2025·0 cites·15 claims
- 3667US7550841B2Methods of forming a diamond micro-channel structure and resulting devicesINTEL CORP·Filed 2006·Granted Jun 23, 2009·3 cites·12 claims
- 3766US7594321B2Substrate-imprinting methodsINTEL CORP·Filed 2007·Granted Sep 29, 2009·3 cites·29 claims
- 3861US8404519B2Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patternsCHRYSLER GREGORY M·Filed 2011·Granted Mar 26, 2013·2 cites·8 claims
- 3961US7400041B2Compliant multi-composition interconnectsMUTHUKUMAR SRIRAM·Filed 2004·Granted Jul 15, 2008·10 cites·11 claims
- 4061US2024279549A1Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 4157US7964447B2Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metalINTEL CORP·Filed 2009·Granted Jun 21, 2011·3 cites·8 claims
- 4257US2020020545A1Etching CompositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Application pending·0 cites
- 4356US2024059968A1Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 4456US2024010952A1Cleaning CompositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 4555US2025101303A1Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 4654US10787628B2Cleaning compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Sep 29, 2020·0 cites·90 claims
- 4751US7637008B2Methods for manufacturing imprinted substratesINTEL CORP·Filed 2002·Granted Dec 29, 2009·4 cites·21 claims
- 4851US7479687B2Deep via seed repair using electroless plating chemistryINTEL CORP·Filed 2005·Granted Jan 20, 2009·0 cites·7 claims
- 4948US2008023791A1High performance integrated inductorMUTHUKUMAR SRIRAM·Filed 2007·Application pending·0 cites
- 5047US7294525B2High performance integrated inductorINTEL CORP·Filed 2005·Granted Nov 13, 2007·0 cites·21 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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