Inventor · disambiguated record
Masao Kawasumi
Also filed as: KAWASUMI MASAO
4 granted patents·1 pending application·60 citations·filing 1991–2005
77Inventor score
Files withHITACHI CHEMICAL CO LTD5
Top patents by PatentIndex Score
5 records- 0185US5350811AEpoxy resin and adhesive composition containing the sameHITACHI CHEMICAL CO LTD·Filed 1993·Granted Sep 27, 1994·32 cites·3 claims
- 0263US6774501B2Resin-sealed semiconductor device, and die bonding material and sealing material for use thereinHITACHI CHEMICAL CO LTD·Filed 2001·Granted Aug 10, 2004·6 cites·24 claims
- 0352US5258139AEpoxy resin and adhesive composition containing the sameHITACHI CHEMICAL CO LTD·Filed 1991·Granted Nov 2, 1993·7 cites·13 claims
- 0444US5188767AElectroconductive resin paste containing mixed epoxy resin and electroconductive metal powderHITACHI CHEMICAL CO LTD·Filed 1991·Granted Feb 23, 1993·15 cites·9 claims
- 0537US2007290369A1Resin Paste For Die Bonding And Its UseHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →