Inventor · disambiguated record
John A. Rice
Also filed as: RICE JOHN · RICE JOHN A
10 granted patents·2 pending applications·84 citations·filing 1991–2022
87Inventor score
Files withSEAGATE TECHNOLOGY LLC7PHILIPS CORP2COMPOSITE TECHNOLOGY DEV INC1DOW CHEMICAL CO1RICE JOHN A1
Top patents by PatentIndex Score
12 records- 0191US11377749B1Electrodeposition of high damping magnetic alloysSEAGATE TECHNOLOGY LLC·Filed 2019·Granted Jul 5, 2022·3 cites·16 claims
- 0287US6778357B2Electrodeposited high-magnetic-moment material at writer gap poleSEAGATE TECHNOLOGY LLC·Filed 2001·Granted Aug 17, 2004·28 cites·20 claims
- 0381US6407339B1Ceramic electrical insulation for electrical coils, transformers, and magnetsCOMPOSITE TECHNOLOGY DEV INC·Filed 1999·Granted Jun 18, 2002·42 cites·14 claims
- 0480US11798583B1Electrodeposition of thermally stable alloysSEAGATE TECHNOLOGY LLC·Filed 2021·Granted Oct 24, 2023·1 cites·7 claims
- 0579US11913130B1Electrodeposition of high damping magnetic alloysSEAGATE TECHNOLOGY LLC·Filed 2022·Granted Feb 27, 2024·0 cites·15 claims
- 0672US11152020B1Electrodeposition of thermally stable alloysSEAGATE TECHNOLOGY LLC·Filed 2019·Granted Oct 19, 2021·2 cites·9 claims
- 0745US2019112722A1Electrodeposition of high damping magnetic alloysSEAGATE TECHNOLOGY LLC·Filed 2017·Application pending·0 cites
- 0843USD946086SGame boardRICE JOHN A·Filed 2018·Granted Mar 15, 2022·4 cites·1 claims
- 0934US2002057531A1HGA ballbond assembly with wafer process assembly featuresSEAGATE TECHNOLOGY LLC·Filed 2001·Application pending·0 cites
- 1030US5133920AMethod for forming composite simulated ivory materialsDOW CHEMICAL CO·Filed 1991·Granted Jul 28, 1992·1 cites·11 claims
- 1125US5995336AComposite structure with single domain magnetic element, and thin film magnetic head incorporating samePHILIPS CORP·Filed 1993·Granted Nov 30, 1999·2 cites·7 claims
- 1224US5269895AMethod of making composite structure with single domain magnetic elementPHILIPS CORP·Filed 1991·Granted Dec 14, 1993·1 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →