Inventor · disambiguated record
Benjamin Michael Sutton
Also filed as: SUTTON BENJAMIN · SUTTON BENJAMIN MICHAEL
11 granted patents·1 pending application·19 citations·filing 2013–2022
85Inventor score
Top patents by PatentIndex Score
12 records- 0189US10991641B2Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 27, 2021·2 cites·13 claims
- 0283US10256027B2Embedded coil assembly and production methodTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 9, 2019·5 cites·18 claims
- 0377US11738404B2Method to eliminate dissimilar metal weldsELECTRIC POWER RES INSTITUTE INC·Filed 2022·Granted Aug 29, 2023·0 cites·6 claims
- 0477US10643929B2Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit diesTEXAS INSTRUMENTS INC·Filed 2014·Granted May 5, 2020·2 cites·13 claims
- 0576US9824811B2Embedded coil assembly and method of makingTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 21, 2017·2 cites·19 claims
- 0670US11676884B2Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit diesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 0765US10854370B2Embedded coil assembly and method of makingTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 1, 2020·0 cites·12 claims
- 0864US10978239B2Embedded coil assembly and method of makingTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 13, 2021·0 cites·18 claims
- 0963US11298774B2Method to eliminate dissimilar metal weldsELECTRIC POWER RES INSTITUTE INC·Filed 2017·Granted Apr 12, 2022·0 cites·4 claims
- 1063USD860779SContainerACCESS BUSINESS GROUP INT LLC·Filed 2018·Granted Sep 24, 2019·8 cites·1 claims
- 1151US9527728B2Integrated circuit package and methodTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 27, 2016·0 cites·20 claims
- 1246US2016096727A1Integrated circuit package methodTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →