Inventor · disambiguated record
Bor Kai Wang
Also filed as: WANG BOR KAI
1 granted patent·2 pending applications·10 citations·filing 2015–2016
35Inventor score
Files withCORNING INC3
Top patents by PatentIndex Score
3 records- 0187US9263300B2Etch back processes of bonding material for the manufacture of through-glass viasCORNING INC·Filed 2015·Granted Feb 16, 2016·10 cites·20 claims
- 0240US2016155696A1Etch back processes of bonding material for the manufacture of through-glass viasCORNING INC·Filed 2016·Application pending·0 cites
- 0332US2018052263A1Privacy filterCORNING INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →