Inventor · disambiguated record
Fabio Brucchi
Also filed as: BRUCCHI FABIO
13 granted patents·3 pending applications·26 citations·filing 2012–2020
87Inventor score
Files withINFINEON TECHNOLOGIES AUSTRIA AG7INFINEON TECHNOLOGIES AG4INFINEON TECHNOLOGIES AUSTRIA3OTREMBA RALF2
Top patents by PatentIndex Score
16 records- 0191US9741570B1Method of manufacturing a reverse-blocking IGBTINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 22, 2017·7 cites·16 claims
- 0281US8815647B2Chip package and a method for manufacturing a chip packageOTREMBA RALF·Filed 2012·Granted Aug 26, 2014·6 cites·24 claims
- 0380US9263563B2Semiconductor device packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Feb 16, 2016·6 cites·9 claims
- 0476US8766430B2Semiconductor modules and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Jul 1, 2014·4 cites·23 claims
- 0573US9082759B2Semiconductor packages and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 14, 2015·3 cites·34 claims
- 0659US2021020541A1Thermal interface material having defined thermal, mechanical and electric propertiesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Application pending·0 cites
- 0756US10109544B2Baseplate for an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 23, 2018·0 cites·18 claims
- 0856US9305874B2Baseplate for an electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 5, 2016·0 cites·14 claims
- 0954US10276708B2Reverse-blocking IGBT having a reverse-blocking edge termination structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Apr 30, 2019·0 cites·14 claims
- 1053US9716018B2Method of manufacturing baseplate for an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 25, 2017·0 cites·18 claims
- 1147US10201087B2Discrete deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 1247US2017117208A1Thermal interface material having defined thermal, mechanical and electric propertiesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Application pending·0 cites
- 1343US9099391B2Semiconductor package with top-side insulation layerINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·0 cites·7 claims
- 1441US2014210061A1Chip arrangement and chip packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 1539US9648776B2Electronic module, electronic system and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted May 9, 2017·0 cites·14 claims
- 1636US9978671B2Power semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted May 22, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →