Inventor · disambiguated record
Chan-Min Han
Also filed as: HAN CHAN M · HAN CHAN-MIN
4 granted patents·2 pending applications·152 citations·filing 1995–2011
79Inventor score
Top patents by PatentIndex Score
6 records- 0182US6262581B1Test carrier for unpackaged semiconducter chipSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 17, 2001·62 cites·19 claims
- 0282US5606196AHigh-frequency, high-density semiconductor chip package with screening bonding wiresSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Feb 25, 1997·77 cites·20 claims
- 0368US8487452B2Semiconductor package having a stacked structureLEE JIN-YANG·Filed 2011·Granted Jul 16, 2013·4 cites·17 claims
- 0459US7606046B2Semiconductor device and method for mitigating electrostatic discharge (ESD)SAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 20, 2009·9 cites·20 claims
- 0539US2008073762A1Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0638US2008073761A1Semiconductor package and stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →