Inventor · disambiguated record
Doo Cheol Park
Also filed as: PARK DOO C · PARK DOO CHEOL
6 granted patents·5 pending applications·13 citations·filing 2005–2013
75Inventor score
Top patents by PatentIndex Score
11 records- 0175US7820468B2Stack type surface acoustic wave package, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Oct 26, 2010·6 cites·9 claims
- 0269US9118856B2Sensor, data processing system, and operating methodKIM WON JOO·Filed 2012·Granted Aug 25, 2015·2 cites·17 claims
- 0369US7336017B2Stack type surface acoustic wave package, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 26, 2008·5 cites·13 claims
- 0456US9029785B2Method of fabricating microlens, and depth sensor including microlensPARK DOO CHEOL·Filed 2012·Granted May 12, 2015·0 cites·12 claims
- 0552US7875491B2CMOS image sensors and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 25, 2011·0 cites·20 claims
- 0650US8193600B2Shared-pixel-type image sensor and method of fabricating the sameNOH HYUN-PIL·Filed 2009·Granted Jun 5, 2012·0 cites·13 claims
- 0750US2008224190A1Image sensor and method of fabricating the sameLEE JONG-MIN·Filed 2008·Application pending·0 cites
- 0845US2014015932A13dimension image sensor and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0943US2007145541A1Stack type surface acoustic wave package, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1040US2006250049A1Surface acoustic wave device packageSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1140US2006194370A1Radio frequency module and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →