Inventor · disambiguated record
Raymond R. Horton
Also filed as: HORTON RAYMOND · HORTON RAYMOND R · HORTON RAYMOND ROBERT
46 granted patents·4 pending applications·940 citations·filing 1988–2020
98Inventor score
Top patents by PatentIndex Score
50 records- 0197US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0296US6534863B2Common ball-limiting metallurgy for I/O sitesIBM·Filed 2001·Granted Mar 18, 2003·112 cites·17 claims
- 0393US7435627B2Techniques for providing decoupling capacitanceIBM·Filed 2005·Granted Oct 14, 2008·18 cites·11 claims
- 0491US6326696B1Electronic package with interconnected chipsIBM·Filed 1998·Granted Dec 4, 2001·107 cites·22 claims
- 0589US4875614AAlignment deviceIBM·Filed 1988·Granted Oct 24, 1989·90 cites·28 claims
- 0687US7488624B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Feb 10, 2009·9 cites·11 claims
- 0783US7691669B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Apr 6, 2010·7 cites·15 claims
- 0881US7791168B2Techniques for providing decoupling capacitanceIBM·Filed 2007·Granted Sep 7, 2010·6 cites·15 claims
- 0978US6697037B1TFT LCD active data line repairIBM·Filed 1996·Granted Feb 24, 2004·56 cites·14 claims
- 1077US7741231B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Jun 22, 2010·4 cites·12 claims
- 1176US6306686B1Method of fabricating an electronic package with interconnected chipsIBM·Filed 2000·Granted Oct 23, 2001·22 cites·5 claims
- 1275US8342385B2Process for mapping formic acid distributionIBM·Filed 2011·Granted Jan 1, 2013·4 cites·13 claims
- 1374US7282391B1Method for precision assembly of integrated circuit chip packagesIBM·Filed 2006·Granted Oct 16, 2007·5 cites·22 claims
- 1474US5186632AElectronic device elastomeric mounting and interconnection technologyIBM·Filed 1991·Granted Feb 16, 1993·36 cites·15 claims
- 1571US4937006AMethod and apparatus for fluxless solder bondingIBM·Filed 1988·Granted Jun 26, 1990·43 cites·22 claims
- 1667US5948286ADiffusion bonding of lead interconnections using precise laser-thermosonic energyIBM·Filed 1997·Granted Sep 7, 1999·34 cites·3 claims
- 1763US7449067B2Method and apparatus for filling viasIBM·Filed 2003·Granted Nov 11, 2008·12 cites·19 claims
- 1863US5117275AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1990·Granted May 26, 1992·28 cites·12 claims
- 1962US11587860B2Method of forming thin die stack assembliesIBM·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 2062US7199450B2Materials and method to seal vias in silicon substratesIBM·Filed 2005·Granted Apr 3, 2007·2 cites·7 claims
- 2161US5263620AWirebond removal apparatus using alternating fluid streamIBM·Filed 1992·Granted Nov 23, 1993·30 cites·20 claims
- 2261US5006925AThree dimensional microelectric packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·9 claims
- 2356US5052606ATape automated bonding feederIBM·Filed 1990·Granted Oct 1, 1991·27 cites·16 claims
- 2455US10903153B2Thinned die stackIBM·Filed 2018·Granted Jan 26, 2021·0 cites·17 claims
- 2551US7615405B2Method for precision assembly of integrated circuit chip packagesIBM·Filed 2007·Granted Nov 10, 2009·0 cites·15 claims
- 2648US5229328AMethod for bonding dielectric mounted conductors to semiconductor chip contact padsIBM·Filed 1992·Granted Jul 20, 1993·17 cites·20 claims
- 2747US5669437AHigh efficiency thermal interposerIBM·Filed 1993·Granted Sep 23, 1997·9 cites·18 claims
- 2846US5734196AElectronic packaging shaped beam lead fabricationIBM·Filed 1995·Granted Mar 31, 1998·12 cites·6 claims
- 2946US2006027934A1Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2005·Application pending·0 cites
- 3045US5205461AMethod and apparatus for fluxless solder bondingIBM·Filed 1990·Granted Apr 27, 1993·16 cites·12 claims
- 3144US5847926ALightweight packagingIBM·Filed 1996·Granted Dec 8, 1998·11 cites·15 claims
- 3244US5446261ASolder application system using helix to control solder meniscusIBM·Filed 1993·Granted Aug 29, 1995·9 cites·13 claims
- 3342US5233221AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1991·Granted Aug 3, 1993·11 cites·17 claims
- 3441US5641114AControlled temperature bondingIBM·Filed 1995·Granted Jun 24, 1997·8 cites·12 claims
- 3541US2012091585A1Laser release process for very thin si-carrier buildBUCHWALTER LEENA P·Filed 2011·Application pending·0 cites
- 3640US2003092254A1Common ball-limiting metallurgy for I/O sitesFiled 2002·Application pending·0 cites
- 3739US8187923B2Laser release process for very thin Si-carrier buildANDRY PAUL STEPHEN·Filed 2008·Granted May 29, 2012·0 cites·10 claims
- 3839US5676301ACastellated nozzle and method of use thereofIBM·Filed 1996·Granted Oct 14, 1997·8 cites·21 claims
- 3939US5675884AApparatus for multilayer conductor chip packagingIBM·Filed 1995·Granted Oct 14, 1997·6 cites·6 claims
- 4038US5768770AElectronic packaging shaped beam lead fabricationFiled 1995·Granted Jun 23, 1998·5 cites·10 claims
- 4137US6734363B1Lightweight electronic equipment conductor with coolant permeable supportIBM·Filed 1998·Granted May 11, 2004·6 cites·11 claims
- 4237US5074969AComposition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrateIBM·Filed 1991·Granted Dec 24, 1991·8 cites·8 claims
- 4336US2008036084A1Laser release process for very thin Si-carrier buildIBM·Filed 2006·Application pending·0 cites
- 4435US6029881AMicro-scale part positioning by surface interlockingIBM·Filed 1997·Granted Feb 29, 2000·4 cites·16 claims
- 4535US5915462AHigh efficiency thermal interposerIBM·Filed 1997·Granted Jun 29, 1999·5 cites·2 claims
- 4632US5038195AComposition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrateIBM·Filed 1990·Granted Aug 6, 1991·4 cites·49 claims
- 4730US6295128B1Optical alignment of superpositioned objectsIBM·Filed 1995·Granted Sep 25, 2001·0 cites·7 claims
- 4830US5687078AFine pitch bondingIBM·Filed 1995·Granted Nov 11, 1997·0 cites·10 claims
- 4930US5322204AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1993·Granted Jun 21, 1994·0 cites·5 claims
- 5027US5593083ACastellated nozzle and method of use therofIBM·Filed 1995·Granted Jan 14, 1997·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →