Inventor · disambiguated record
Yang-Kuo Kuo
Also filed as: KUO YANG-KUO
9 granted patents·7 pending applications·16 citations·filing 2012–2020
79Inventor score
Files withNAT CHUNG SHAN INST SCIENCE & TECH8NAT INST CHUNG SHAN SCIENCE & TECHNOLOGY4KUO YANG-KUO2CHUNG SHAN INST OF SCIENCE1NATIONAL CHUNG SHAN INSTITUTE OF SCEINCE AND TECH1
Top patents by PatentIndex Score
16 records- 0193US10144645B1Method for preparing spherical aluminum oxynitride powderNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Dec 4, 2018·11 cites·10 claims
- 0281US9978590B1Method of manufacturing epitaxiable heat-dissipating substrateNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted May 22, 2018·4 cites·11 claims
- 0362US10362684B1Method for improving adhesion between ceramic carrier and thick film circuitNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2018·Granted Jul 23, 2019·1 cites·11 claims
- 0450US10711342B2Method of producing secondary lens with hollow nano structures for uniform illuminanceNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Jul 14, 2020·0 cites·13 claims
- 0550US10384941B2Method for producing spherical silicon nitride powderNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Aug 20, 2019·0 cites·13 claims
- 0647US10923621B2Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrateNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2019·Granted Feb 16, 2021·0 cites·3 claims
- 0744US11056796B2Directly flat-attached switching component for active frequency selective surface and fabricating method thereofNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2019·Granted Jul 6, 2021·0 cites·18 claims
- 0844US10060036B2Plated-layer structure for improving interface stress between aluminium nitride substrate and copper-plated layerNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2015·Granted Aug 28, 2018·0 cites·8 claims
- 0941US2015155194A1Method of preparing heterogeneous stacked co-fired ceramic for use in an aluminum nitride electrostatic chuckNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 1039US2015348893A1Method of manufacturing three-dimensional integrated circuit comprising aluminum nitride interposerNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 1139US2021111304A1Surface modification method of aluminum nitride ceramic substrateNATIONAL CHUNG SHAN INSTITUTE OF SCEINCE AND TECH·Filed 2020·Application pending·0 cites
- 1238US2015345044A1Method of electroplating cobalt alloy to wiring surfaceNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 1337US2014075960A1Cooling Device For Electronic ComponentsCHUNG SHAN INST OF SCIENCE·Filed 2012·Application pending·0 cites
- 1423US9196508B2Method for producing three-dimensional integrated circuit structureKUO YANG-KUO·Filed 2012·Granted Nov 24, 2015·0 cites·7 claims
- 1523US2016148917A1Cooling device for electronic componentsNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2016·Application pending·0 cites
- 1622US2014034948A1LED epitaxial StructureKUO YANG-KUO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →