Inventor · disambiguated record
Tsung-Ming Pai
Also filed as: PAI TSUNG MING
7 granted patents·3 pending applications·243 citations·filing 2000–2018
87Inventor score
Top patents by PatentIndex Score
10 records- 0189US6503776B2Method for fabricating stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Jan 7, 2003·75 cites·18 claims
- 0288US7052935B2Flip-chip package and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 30, 2006·80 cites·5 claims
- 0385US10509250B2Cholesteric liquid crystal writing boardIRIS OPTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·21 claims
- 0484US6387728B1Method for fabricating a stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted May 14, 2002·53 cites·10 claims
- 0571US6541871B2Method for fabricating a stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 1, 2003·20 cites·6 claims
- 0663US7023079B2Stacked semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 4, 2006·12 cites·6 claims
- 0745US10551660B2Cholesteric liquid crystal writing boardIRIS OPTRONICS CO LTD·Filed 2018·Granted Feb 4, 2020·0 cites·14 claims
- 0844US2019293981A1Cholesteric liquid crystal writing boardIRIS OPTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0944US2019285923A1Cholesteric liquid crystal writing boardIRIS OPTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1034US2002140073A1Multichip moduleADVANCED SEMICONDUCTOR ENG·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tsung-Ming Pai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →