Inventor · disambiguated record
Kazuyuki Nakanishi
Also filed as: NAKANISHI KAZUYUKI
54 granted patents·6 pending applications·310 citations·filing 1993–2025
98Inventor score
Top patents by PatentIndex Score
60 records- 0195US11949413B2Semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2022·Granted Apr 2, 2024·2 cites·12 claims
- 0294US7592676B2Semiconductor device with a transistor having different source and drain lengthsPANASONIC CORP·Filed 2007·Granted Sep 22, 2009·24 cites·14 claims
- 0391US8368225B2Semiconductor integrated circuit device having improved interconnect accuracy near cell boundariesPANASONIC CORP·Filed 2011·Granted Feb 5, 2013·12 cites·16 claims
- 0491US7148735B2Level shifter having automatic delay adjusting functionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Dec 12, 2006·23 cites·2 claims
- 0590US8692336B2Semiconductor deviceTAMARU MASAKI·Filed 2012·Granted Apr 8, 2014·9 cites·9 claims
- 0689US8946824B2Semiconductor devicePANASONIC CORP·Filed 2014·Granted Feb 3, 2015·7 cites·18 claims
- 0787US7800140B2Semiconductor integrated circuitPANASONIC CORP·Filed 2008·Granted Sep 21, 2010·13 cites·16 claims
- 0885US8119242B2Amorphous carbon film, process for forming amorphous carbon film, conductive member provided with amorphous carbon film, and fuel cell separatorISEKI TAKASHI·Filed 2007·Granted Feb 21, 2012·9 cites·50 claims
- 0985US7475375B2Layout structure allowing independent supply of substrate/power supply potential of standard cellPANASONIC CORP·Filed 2006·Granted Jan 6, 2009·12 cites·14 claims
- 1084US8946826B2Semiconductor devicePANASONIC CORP·Filed 2014·Granted Feb 3, 2015·4 cites·4 claims
- 1184US7939858B2Semiconductor device with a transistor having different source and drain lengthsPANASONIC CORP·Filed 2009·Granted May 10, 2011·8 cites·10 claims
- 1283US8399928B2Semiconductor deviceIKEGAMI TOMOAKI·Filed 2011·Granted Mar 19, 2013·7 cites·8 claims
- 1381US8999604B2Oriented amorphous carbon film and process for forming the sameISEKI TAKASHI·Filed 2010·Granted Apr 7, 2015·2 cites·11 claims
- 1481US8431967B2Semiconductor deviceNAKANISHI KAZUYUKI·Filed 2011·Granted Apr 30, 2013·6 cites·5 claims
- 1580US8993197B2Bipolar plate for fuel cell and method for producing the sameISEKI TAKASHI·Filed 2010·Granted Mar 31, 2015·4 cites·9 claims
- 1680US8004014B2Semiconductor integrated circuit device having metal interconnect regions placed symmetrically with respect to a cell boundaryPANASONIC CORP·Filed 2009·Granted Aug 23, 2011·6 cites·25 claims
- 1780US7507305B2Wear-resistant copper-based alloyTOYOTA MOTOR CO LTD·Filed 2004·Granted Mar 24, 2009·11 cites·11 claims
- 1880US7427439B2Amorphous-carbon coated memberJTEKT CORP·Filed 2006·Granted Sep 23, 2008·10 cites·11 claims
- 1979US7850795B2Build-up wear-resistant copper alloy and valve seatTOYOTA MOTOR CO LTD·Filed 2005·Granted Dec 14, 2010·6 cites·1 claims
- 2079US7833626B2Amorphous carbon film, process for forming the same, and high wear-resistant sliding member with amorphous carbon film providedTOYOTA CHUO KENKYUSHO KK·Filed 2005·Granted Nov 16, 2010·4 cites·20 claims
- 2177US11115009B2Semiconductor integrated circuitPANASONIC SEMICONDUCTOR SOLUTIONS CO LTD·Filed 2020·Granted Sep 7, 2021·1 cites·5 claims
- 2277US10593702B2Semiconductor deviceSOCIONEXT INC·Filed 2018·Granted Mar 17, 2020·1 cites·26 claims
- 2376US10083985B2Semiconductor deviceSOCIONEXT INC·Filed 2017·Granted Sep 25, 2018·1 cites·18 claims
- 2476US8525552B2Semiconductor integrated circuit device having a plurality of standard cells for leakage current suppressionANDO TAKASHI·Filed 2012·Granted Sep 3, 2013·4 cites·16 claims
- 2576US7677375B2Drive force transmission deviceJTEKT CORP·Filed 2006·Granted Mar 16, 2010·5 cites·8 claims
- 2676US7537835B2High friction sliding memberTOYOTA CHUO KENKYUSHO KK·Filed 2002·Granted May 26, 2009·13 cites·11 claims
- 2775US8791507B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Jul 29, 2014·3 cites·3 claims
- 2874US9741740B2Semiconductor deviceSOCIONEXT INC·Filed 2016·Granted Aug 22, 2017·1 cites·11 claims
- 2973US7815756B2Build-up wear-resistant copper-based alloyTOYOTA MOTOR CO LTD·Filed 2006·Granted Oct 19, 2010·1 cites·9 claims
- 3071US5443662AMethod of forming a nitride or carbonitride layerTOYODA CHUO KENKYUSHO KK·Filed 1993·Granted Aug 22, 1995·31 cites·8 claims
- 3170US10283785B2Amorphous carbon film, process for forming amorphous carbon film, electrically conductive member and fuel cell bipolar plate having amorphous carbon filmTOYOTA CHUO KENKYUSHO KK·Filed 2013·Granted May 7, 2019·1 cites·15 claims
- 3268US9362264B2Semiconductor device comprising a plurality of cell arrays including a well potential supply region and adjacent dummy gates provided on a well region of a cell arrayPANASONIC CORP·Filed 2014·Granted Jun 7, 2016·1 cites·13 claims
- 3365US8461920B2Semiconductor integrated circuit deviceNAKANISHI KAZUYUKI·Filed 2012·Granted Jun 11, 2013·2 cites·15 claims
- 3465US7721642B2Sliding memberTOYOTA JIDOSHOKKI KK·Filed 2008·Granted May 25, 2010·3 cites·5 claims
- 3565US2025296114A1Acrylic acid plasma polymerization film and production method thereforTOYODA GOSEI KK·Filed 2025·Application pending·0 cites
- 3663US8698273B2Semiconductor integrated circuit device having improved interconnect accuracy near cell boundariesPANASONIC CORP·Filed 2012·Granted Apr 15, 2014·1 cites·3 claims
- 3763US7455824B2Amorphous carbon, amorphous-carbon coated member, and process for forming amorphous carbon filmTOYOTA CHUO KENKYUSHO KK·Filed 2004·Granted Nov 25, 2008·5 cites·12 claims
- 3863US6090497AWear-resistant coated memberTOYODA CHUO KENKYUSHO KK·Filed 1998·Granted Jul 18, 2000·16 cites·9 claims
- 3961US9142611B2Semiconductor integrated circuit devicePANASONIC CORP·Filed 2014·Granted Sep 22, 2015·1 cites·9 claims
- 4060US7815028B2Clutch plate, friction clutch, and coupling deviceJTEKT CORP·Filed 2003·Granted Oct 19, 2010·5 cites·24 claims
- 4158US6853228B2Flip-flop circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 8, 2005·8 cites·10 claims
- 4257US9142539B2Semiconductor deviceSOCIONEXT INC·Filed 2014·Granted Sep 22, 2015·0 cites·15 claims
- 4356US7404866B2Sliding member and method for manufacture thereofTOYOTA CHUO KENKYUSHO KK·Filed 2002·Granted Jul 29, 2008·3 cites·14 claims
- 4455US8748987B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Jun 10, 2014·0 cites·14 claims
- 4555US7396735B2Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing sameTOYOTA CHUO KENKYUSYO KK·Filed 2003·Granted Jul 8, 2008·7 cites·20 claims
- 4654US8598668B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Dec 3, 2013·0 cites·18 claims
- 4754US5620521AMethod for surface treatmentTOYODA CHUO KENKYUSHO KK·Filed 1995·Granted Apr 15, 1997·17 cites·18 claims
- 4853US2022200595A1Semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2022·Application pending·0 cites
- 4951US11711070B2Semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2022·Granted Jul 25, 2023·0 cites·7 claims
- 5051US9871503B2Semiconductor integrated circuit, latch circuit, and flip-flop circuitPANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 16, 2018·0 cites·5 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →