Inventor · disambiguated record
Koji Omote
Also filed as: OMOTE KOJI
17 granted patents·2 pending applications·381 citations·filing 1990–2018
94Inventor score
Top patents by PatentIndex Score
19 records- 0196US7211899B2Circuit substrate and method for fabricating the sameFUJITSU LTD·Filed 2003·Granted May 1, 2007·83 cites·7 claims
- 0292US7678695B2Circuit substrate and method for fabricating the sameFUJITSU LTD·Filed 2007·Granted Mar 16, 2010·21 cites·10 claims
- 0392US6768205B2Thin-film circuit substrateFUJITSU LTD·Filed 2002·Granted Jul 27, 2004·97 cites·4 claims
- 0486US7557014B2Semiconductor system-in-packageFUJITSU LTD·Filed 2006·Granted Jul 7, 2009·12 cites·6 claims
- 0584US7176556B2Semiconductor system-in-packageFUJITSU LTD·Filed 2002·Granted Feb 13, 2007·33 cites·13 claims
- 0677US5607535AMethod of manufacturing a laminated piezoelectric actuatorFUJITSU LTD·Filed 1994·Granted Mar 4, 1997·38 cites·11 claims
- 0772US8747600B2Enclosure and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Jun 10, 2014·2 cites·11 claims
- 0869US7139176B2Circuit substrate and method for fabricating the sameFUJITSU LTD·Filed 2002·Granted Nov 21, 2006·13 cites·18 claims
- 0966US11306022B2Casing, electronic device, and casing production methodFUJITSU LTD·Filed 2018·Granted Apr 19, 2022·0 cites·9 claims
- 1065US7049229B2Method of fabricating semiconductor device and semiconductor deviceFUJITSU LTD·Filed 2004·Granted May 23, 2006·12 cites·36 claims
- 1161US6979644B2Method of manufacturing electronic circuit componentFUJITSU LTD·Filed 2003·Granted Dec 27, 2005·8 cites·10 claims
- 1254US2014329038A1Enclosure and method of manufacturing the sameFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1353US5575872AMethod for forming a ceramic circuit substrateFUJITSU LTD·Filed 1994·Granted Nov 19, 1996·22 cites·15 claims
- 1451US5443786AComposition for the formation of ceramic viasFUJITSU LTD·Filed 1990·Granted Aug 22, 1995·19 cites·7 claims
- 1549US9095050B2Plate member for housing, housing, and method of fabricating the sameOMOTE KOJI·Filed 2011·Granted Jul 28, 2015·0 cites·2 claims
- 1645US2017175312A1Member, member manufacturing method, electronic device, and electronic device manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1742US5962955APiezoelectric device and method for fabricating the same, and ink jet printer head and method for fabricating the sameFUJITSU LTD·Filed 1997·Granted Oct 5, 1999·7 cites·4 claims
- 1840US5683529AProcess of producing aluminum nitride multiple-layer circuit boardFUJITSU LTD·Filed 1996·Granted Nov 4, 1997·9 cites·20 claims
- 1939US6097412AInk jet printer head and method for fabricating the same including a piezoelectric device with a multilayer body having a pair of high rigidity plates provided on the side wallsFUJITSU LTD·Filed 1998·Granted Aug 1, 2000·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →