Inventor · disambiguated record
James E. Clayton
Also filed as: CLAYTON JAMES · CLAYTON JAMES E · CLAYTON JAMES ELLIOTT
45 granted patents·7 pending applications·2,660 citations·filing 1986–2022
99Inventor score
Files withCLAYTON JAMES E15IMMUNOLIGHT LLC9MICROELECTRONICS ASSEMBLY TECH7CLEANVOLT ENERGY INC6WANG LABORATORIES3
Top patents by PatentIndex Score
52 records- 0199US5708297AThin multichip moduleFiled 1995·Granted Jan 13, 1998·290 cites·4 claims
- 0298US11270973B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2020·Granted Mar 8, 2022·4 cites·6 claims
- 0398US7796399B2Thin multi-chip flex moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2008·Granted Sep 14, 2010·110 cites·11 claims
- 0498US6410415B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 2000·Granted Jun 25, 2002·249 cites·39 claims
- 0598US6232659B1Thin multichip moduleFiled 2000·Granted May 15, 2001·152 cites·1 claims
- 0698US5751553AThin multichip module including a connector frame socket having first and second aperturesFiled 1995·Granted May 12, 1998·232 cites·3 claims
- 0798US4656605ASingle in-line memory moduleWANG LABORATORIES·Filed 1986·Granted Apr 7, 1987·255 cites·1 claims
- 0897US10593642B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2019·Granted Mar 17, 2020·4 cites·30 claims
- 0997US8929054B2Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methodsCLEANVOLT ENERGY INC·Filed 2013·Granted Jan 6, 2015·25 cites·32 claims
- 1097US6049975AMethod of forming a thin multichip moduleFiled 1998·Granted Apr 18, 2000·179 cites·9 claims
- 1196US7393226B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Jul 1, 2008·45 cites·10 claims
- 1295US10748868B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2018·Granted Aug 18, 2020·7 cites·55 claims
- 1395US6091145AThin multichip module including a connector frame socketFiled 1998·Granted Jul 18, 2000·121 cites·1 claims
- 1495US5731633AThin multichip moduleHAMILTON GARY W·Filed 1993·Granted Mar 24, 1998·177 cites·29 claims
- 1595US4727513ASignal in-line memory moduleWANG LABORATORIES·Filed 1987·Granted Feb 23, 1988·136 cites·2 claims
- 1694US11476222B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2020·Granted Oct 18, 2022·3 cites·16 claims
- 1794US10074627B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2017·Granted Sep 11, 2018·7 cites·157 claims
- 1894US7394149B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Jul 1, 2008·29 cites·8 claims
- 1994US5661339AThin multichip moduleFiled 1994·Granted Aug 26, 1997·167 cites·37 claims
- 2094US4850892AConnecting apparatus for electrically connecting memory modules to a printed circuit boardWANG LABORATORIES·Filed 1988·Granted Jul 25, 1989·184 cites·11 claims
- 2193US10283476B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2017·Granted May 7, 2019·8 cites·27 claims
- 2293US9023249B2Adhesive bonding composition and method of useFATHI ZAKARYAE·Filed 2011·Granted May 5, 2015·23 cites·17 claims
- 2393US8559181B2Thin multi-chip flex moduleCLAYTON JAMES E·Filed 2011·Granted Oct 15, 2013·13 cites·12 claims
- 2493US7724530B2Thin multi-chip flex moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2008·Granted May 25, 2010·19 cites·13 claims
- 2593US6665190B2Modular PC card which receives add-in PC card modulesFiled 2002·Granted Dec 16, 2003·85 cites·22 claims
- 2691US11901331B2Adhesive bonding composition and electronic components prepared from the sameIMMUNOLIGHT LLC·Filed 2022·Granted Feb 13, 2024·1 cites·15 claims
- 2791US9746879B2Rigid circuit board with flexibly attached moduleCLAYTON JAMES E·Filed 2015·Granted Aug 29, 2017·7 cites·7 claims
- 2890US7429788B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Sep 30, 2008·21 cites·18 claims
- 2989US8837141B2Electronic module with heat spreading enclosureCLAYTON JAMES E·Filed 2012·Granted Sep 16, 2014·9 cites·12 claims
- 3089US7787254B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Aug 31, 2010·18 cites·10 claims
- 3188US8899994B2Compression connector systemCLAYTON JAMES E·Filed 2012·Granted Dec 2, 2014·17 cites·15 claims
- 3287US10026711B2Adhesive bonding composition and wafer-to-wafer bonded assembly prepared from the sameIMMUNOLIGHT LLC·Filed 2016·Granted Jul 17, 2018·3 cites·39 claims
- 3387US9649832B2Adhesive bonding composition and method of useIMMUNOLIGHT LLC·Filed 2015·Granted May 16, 2017·4 cites·33 claims
- 3487US9338895B2Method for making an electrical circuitCLAYTON JAMES E·Filed 2012·Granted May 10, 2016·5 cites·10 claims
- 3585US8834182B2Pierced flexible circuit and compression jointCLAYTON JAMES E·Filed 2012·Granted Sep 16, 2014·8 cites·12 claims
- 3685USRE42252EThin multi-chip flex moduleMICROELECTRONICS ASSEMBLY TECHNOLOGIES INC·Filed 2010·Granted Mar 29, 2011·6 cites·13 claims
- 3784US8692124B2Electrical connector and method of makingCLAYTON JAMES E·Filed 2010·Granted Apr 8, 2014·6 cites·20 claims
- 3883US8817458B2Flexible circuit board and connection systemCLAYTON JAMES E·Filed 2012·Granted Aug 26, 2014·7 cites·24 claims
- 3976US7520781B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Apr 21, 2009·15 cites·1 claims
- 4074US8902606B2Electronic interconnect systemCLAYTON JAMES E·Filed 2012·Granted Dec 2, 2014·3 cites·10 claims
- 4173US8345431B2Thin multi-chip flex moduleMICROELECTRONICS ASSEMBLY TECHNOLOGIES INC·Filed 2008·Granted Jan 1, 2013·4 cites·10 claims
- 4271US2022037086A1Electrodes and currents through the use of organic and organometallic high dielectric constant materials in energy storage devices and associated methodsCLEANVOLT ENERGY INC·Filed 2021·Application pending·0 cites
- 4368US9767960B2Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methodsCLEANVOLT ENERGY INC·Filed 2014·Granted Sep 19, 2017·2 cites·15 claims
- 4466US11139118B2Electrodes and currents through the use of organic and organometallic high dielectric constant materials in energy storage devices and associated methodsCLEANVOLT ENERGY INC·Filed 2018·Granted Oct 5, 2021·0 cites·13 claims
- 4564US12142431B2Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methodsCLEANVOLT ENERGY INC·Filed 2017·Granted Nov 12, 2024·0 cites·5 claims
- 4664US10102978B2Electrodes and currents through the use of organic and organometallic high dielectric constant materials in energy storage devices and associated methodsCLEANVOLT ENERGY INC·Filed 2014·Granted Oct 16, 2018·0 cites·21 claims
- 4759US2016227652A1Method for Making an Electrical CircuitCLAYTON JAMES E·Filed 2016·Application pending·0 cites
- 4856US2014104776A1Rigid circuit board with flexibly attached moduleCLAYTON JAMES E·Filed 2012·Application pending·0 cites
- 4951US2011138617A1Thin multi-chip flex moduleCLAYTON JAMES E·Filed 2011·Application pending·0 cites
- 5049US2008192428A1Thermal management system for computersCLAYTON JAMES E·Filed 2008·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →