Inventor · disambiguated record
Dominik Trüssel
Also filed as: TRUESSEL DOMINIK · TRUSSEL DOMINIK · TRÜSSEL DOMINIK
8 granted patents·2 pending applications·6 citations·filing 2002–2020
75Inventor score
Files withABB TECHNOLOGY AG6ABB POWER GRIDS SWITZERLAND AG1ABB SCHWEIZ AG1HITACHI ENERGY SWITZERLAND AG1TRUESSEL DOMINIK1
Top patents by PatentIndex Score
10 records- 0164US9431376B2Substrate for mounting multiple power transistors thereon and power semiconductor moduleABB TECHNOLOGY AG·Filed 2014·Granted Aug 30, 2016·2 cites·14 claims
- 0264US9035447B2Power semiconductor module and power semiconductor module assembly with multiple power semiconductor modulesABB TECHNOLOGY AG·Filed 2014·Granted May 19, 2015·2 cites·20 claims
- 0348US11362008B2Power semiconductor module embedded in a mold compounded with an openingHITACHI ENERGY SWITZERLAND AG·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 0445US11127685B2Power semiconductor module with dimples in metallization layer below foot of terminalABB POWER GRIDS SWITZERLAND AG·Filed 2020·Granted Sep 21, 2021·0 cites·21 claims
- 0545US9975194B2Method for ultrasonic welding with particles trappingABB TECHNOLOGY AG·Filed 2016·Granted May 22, 2018·0 cites·20 claims
- 0645US8587959B2Electric module with a fastening deviceTRUESSEL DOMINIK·Filed 2011·Granted Nov 19, 2013·2 cites·25 claims
- 0744US7651339B2Electrical terminalABB TECHNOLOGY AG·Filed 2007·Granted Jan 26, 2010·0 cites·29 claims
- 0842US9105489B2Power semiconductor moduleABB TECHNOLOGY AG·Filed 2013·Granted Aug 11, 2015·0 cites·35 claims
- 0934US2005067654A1Pressure-contactable power semiconductor moduleABB SCHWEIZ AG·Filed 2002·Application pending·0 cites
- 1029US2014021640A1Method for electrically connecting vertically positioned substratesABB TECHNOLOGY AG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →