Inventor · disambiguated record
Chung-Hsin Lin
Also filed as: LIN CHUNG-HSIN
4 granted patents·7 pending applications·10 citations·filing 2004–2025
67Inventor score
Files withNANYA TECHNOLOGY CORP6CHI MEI LIGHTING TECH CORP1CHIOU SHIN-JIA1HAHN JENS1INFINEON TECHNOLOGIES AG1
Top patents by PatentIndex Score
11 records- 0187US9659886B2Method of fabricating semiconductor device having voids between top metal layers of metal interconnectsNANYA TECHNOLOGY CORP·Filed 2016·Granted May 23, 2017·7 cites·7 claims
- 0280US2025261358A1Method of manufacturing semiconductor device including 3d memory structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0375US2024121940A1Method for manufacturing semiconductor device including 3d memory structureNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0472US2024121939A1Semiconductor device including 3d memory structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0548US9418949B2Semiconductor device having voids between top metal layers of metal interconnectsNANYA TECHNOLOGY CORP·Filed 2013·Granted Aug 16, 2016·0 cites·9 claims
- 0643US7157381B2Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuitsNANYA TECHNOLOGY CORP·Filed 2004·Granted Jan 2, 2007·2 cites·7 claims
- 0741US7413993B2Process for removing a residue from a metal structure on a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 19, 2008·1 cites·27 claims
- 0836US2013146934A1Light-emitting diode deviceCHI MEI LIGHTING TECH CORP·Filed 2012·Application pending·0 cites
- 0935US2013092955A1Light emitting diode and fabricating method thereofCHIOU SHIN-JIA·Filed 2012·Application pending·0 cites
- 1034US2007243708A1Manufacturing method for an integrated semiconductor contact structure having an improved aluminum fillHAHN JENS·Filed 2006·Application pending·0 cites
- 1132US2012305959A1Light-emitting diode device and method for manufacturing the sameYU KUO-HUI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →