Inventor · disambiguated record
Wilma Jean Horkans
Also filed as: HORKANS WILMA J · HORKANS WILMA JEAN
18 granted patents·2 pending applications·1,183 citations·filing 1986–2005
96Inventor score
Files withIBM20
Top patents by PatentIndex Score
20 records- 0199US6224690B1Flip-Chip interconnections using lead-free soldersIBM·Filed 1996·Granted May 1, 2001·191 cites·12 claims
- 0297US5937320ABarrier layers for electroplated SnPb eutectic solder jointsIBM·Filed 1998·Granted Aug 10, 1999·297 cites·18 claims
- 0395US6113769AApparatus to monitor and add plating solution of plating baths and controlling quality of deposited metalIBM·Filed 1997·Granted Sep 5, 2000·96 cites·41 claims
- 0492US6153043AElimination of photo-induced electrochemical dissolution in chemical mechanical polishingIBM·Filed 1998·Granted Nov 28, 2000·122 cites·20 claims
- 0588US6974531B2Method for electroplating on resistive substratesIBM·Filed 2002·Granted Dec 13, 2005·20 cites·23 claims
- 0688US5192403ACyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixturesIBM·Filed 1991·Granted Mar 9, 1993·94 cites·7 claims
- 0787US6406608B1Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metalIBM·Filed 2000·Granted Jun 18, 2002·19 cites·41 claims
- 0887US6251787B1Elimination of photo-induced electrochemical dissolution in chemical mechanical polishingIBM·Filed 2000·Granted Jun 26, 2001·38 cites·23 claims
- 0986US6709562B1Method of making electroplated interconnection structures on integrated circuit chipsIBM·Filed 1999·Granted Mar 23, 2004·90 cites·49 claims
- 1086US5385661AAcid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential depositionIBM·Filed 1993·Granted Jan 31, 1995·43 cites·20 claims
- 1184US6429523B1Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2001·Granted Aug 6, 2002·32 cites·35 claims
- 1284US5582927AHigh magnetic moment materials and process for fabrication of thin film headsIBM·Filed 1994·Granted Dec 10, 1996·33 cites·54 claims
- 1376US6946716B2Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2004·Granted Sep 20, 2005·16 cites·27 claims
- 1473US5196096AMethod for analyzing the addition agents in solutions for electroplating of PbSn alloysIBM·Filed 1992·Granted Mar 23, 1993·42 cites·6 claims
- 1572US4717591APrevention of mechanical and electronic failures in heat-treated structuresIBM·Filed 1986·Granted Jan 5, 1988·35 cites·11 claims
- 1667US6592747B2Method of controlling additives in copper plating bathsIBM·Filed 2001·Granted Jul 15, 2003·7 cites·16 claims
- 1759US6570255B2Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2002·Granted May 27, 2003·7 cites·17 claims
- 1859US2005199502A1Method for electroplating on resistive substratesIBM·Filed 2005·Application pending·0 cites
- 1948US2006017169A1Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2005·Application pending·0 cites
- 2044US7227265B2Electroplated copper interconnection structure, process for making and electroplating bathIBM·Filed 2004·Granted Jun 5, 2007·1 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →