Inventor · disambiguated record
Han Jun Bae
Also filed as: BAE HAN JUN
19 granted patents·2 pending applications·38 citations·filing 2007–2022
90Inventor score
Top patents by PatentIndex Score
21 records- 0195US9214410B2Stack packages and methods of fabricating the sameSK HYNIX INC·Filed 2014·Granted Dec 15, 2015·19 cites·18 claims
- 0283US9806015B1Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Oct 31, 2017·4 cites·20 claims
- 0375US9368482B2Stack packages and methods of fabricating the sameSK HYNIX INC·Filed 2015·Granted Jun 14, 2016·2 cites·10 claims
- 0474US9847285B1Semiconductor packages including heat spreaders and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Dec 19, 2017·2 cites·14 claims
- 0573US9659833B2Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2015·Granted May 23, 2017·2 cites·19 claims
- 0669US9972568B2Stretchable semiconductor packages and semiconductor devices including the sameSK HYNIX INC·Filed 2017·Granted May 15, 2018·1 cites·19 claims
- 0769US9196607B2Stack packages and methods of manufacturing the sameSK HYNIX INC·Filed 2013·Granted Nov 24, 2015·2 cites·18 claims
- 0866US12399014B2Map compression method for indoor positioningUNIV KOREA RES & BUS FOUND·Filed 2022·Granted Aug 26, 2025·0 cites·11 claims
- 0963US12435979B2Low-power method and map data hierarchical segmentation load method for indoor positioningUNIV KOREA RES & BUS FOUND·Filed 2022·Granted Oct 7, 2025·0 cites·13 claims
- 1063US8072046B2Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrodeBAE HAN JUN·Filed 2008·Granted Dec 6, 2011·3 cites·16 claims
- 1161US9543384B2Semiconductor packageSK HYNIX INC·Filed 2015·Granted Jan 10, 2017·1 cites·19 claims
- 1261US7759807B2Semiconductor package having structure for warpage preventionHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jul 20, 2010·2 cites·19 claims
- 1350US11309303B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted Apr 19, 2022·0 cites·14 claims
- 1450US9806016B2Stretchable semiconductor packages and semiconductor devices including the sameSK HYNIX INC·Filed 2016·Granted Oct 31, 2017·0 cites·15 claims
- 1549US9343439B2Stack packages and methods of manufacturing the sameSK HYNIX INC·Filed 2015·Granted May 17, 2016·0 cites·9 claims
- 1648US11270958B2Semiconductor package including capacitorSK HYNIX INC·Filed 2020·Granted Mar 8, 2022·0 cites·23 claims
- 1743US8618637B2Semiconductor package using through-electrodes having voidsBAE HAN JUN·Filed 2008·Granted Dec 31, 2013·0 cites·16 claims
- 1842US2014264848A1Semiconductor package and method for fabricating the sameSK HYNIX INC·Filed 2014·Application pending·0 cites
- 1940US9888567B2Flexible device including sliding interconnection structureSK HYNIX INC·Filed 2016·Granted Feb 6, 2018·0 cites·14 claims
- 2035US11501350B2Device and method for mediating heavy equipment and system using the sameBAE SEOK HO·Filed 2018·Granted Nov 15, 2022·0 cites·6 claims
- 2134US2017033081A1Stack package and method for manufacturing the stack packageSK HYNIX INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →