Inventor · disambiguated record
Xiaoquan Min
Also filed as: MIN XIAOQUAN
8 granted patents·3 pending applications·2 citations·filing 2018–2024
73Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC11
Top patents by PatentIndex Score
11 records- 0179US11600470B2Targeted heat control systemsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·2 cites·20 claims
- 0273US2024363332A1Amorphous carbon for gap fillAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0364US10950445B2Deposition of metal silicide layers on substrates and chamber componentsAPPLIED MATERIALS INC·Filed 2020·Granted Mar 16, 2021·0 cites·20 claims
- 0460US12062536B2Amorphous carbon for gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Aug 13, 2024·0 cites·11 claims
- 0554US10734232B2Deposition of metal silicide layers on substrates and chamber componentsAPPLIED MATERIALS INC·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 0652US11821082B2Reduced defect deposition processesAPPLIED MATERIALS INC·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 0750US12027366B2Reduced hydrogen deposition processesAPPLIED MATERIALS INC·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 0850US11322352B2Nitrogen-doped carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2020·Granted May 3, 2022·0 cites·21 claims
- 0945US12191115B2Dual RF for controllable film depositionAPPLIED MATERIALS INC·Filed 2019·Granted Jan 7, 2025·0 cites·15 claims
- 1041US2021082696A1Systems and methods of formation of a metal hardmask in device fabricationAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1141US2021025056A1Electrostatic chuck for damage-free substrate processingAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →