Inventor · disambiguated record
Masako Watanabe
Also filed as: WATANABE MASAKO
8 granted patents·6 pending applications·152 citations·filing 2002–2012
86Inventor score
Files withTEXAS INSTRUMENTS INC4LINTEC CORP2SENJU METAL INDUSTRY CO2WATANABE MASAKO2AMAGAI MASAZUMI1
Top patents by PatentIndex Score
14 records- 0193US7646193B2Device inspection device, device inspection system using the same, and mobile telephone holding deviceJAPAN NOVEL CORP·Filed 2005·Granted Jan 12, 2010·77 cites·25 claims
- 0284US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0373US6762506B2Assembly of semiconductor device and wiring substrateTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 13, 2004·20 cites·8 claims
- 0469US7701071B2Method for fabricating flip-attached and underfilled semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Apr 20, 2010·3 cites·10 claims
- 0563US6887778B2Semiconductor device and manufacturing methodTEXAS INSTRUMENTS INC·Filed 2002·Granted May 3, 2005·12 cites·9 claims
- 0661US7029542B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Apr 18, 2006·8 cites·12 claims
- 0746US2008157353A1Control of Standoff Height Between Packages with a Solder-Embedded TapeTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 0845US8193085B2Method for fabricating flip-attached and underfilled semiconductor devicesWATANABE MASAKO·Filed 2010·Granted Jun 5, 2012·0 cites·3 claims
- 0942US2010025837A1Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 1042US2010090323A1Composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 1141US2007170599A1Flip-attached and underfilled stacked semiconductor devicesAMAGAI MASAZUMI·Filed 2006·Application pending·0 cites
- 1235US2007243098A1Lead-Free SolderOHNISHI TSUKASA·Filed 2004·Application pending·0 cites
- 1335US2003132520A1Semiconductor device and mounting methodFiled 2003·Application pending·0 cites
- 1434US8598029B2Method for fabricating flip-attached and underfilled semiconductor devicesWATANABE MASAKO·Filed 2012·Granted Dec 3, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →