Inventor · disambiguated record
En-Chiuan Liou
Also filed as: LIOU EN-CHIUAN
138 granted patents·21 pending applications·540 citations·filing 2008–2025
99Inventor score
Top patents by PatentIndex Score
159 records- 0199US9899267B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·81 cites·12 claims
- 0298US9496361B1Selectively deposited metal gates and method of manufacturing thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 15, 2016·25 cites·20 claims
- 0398US9406521B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 2, 2016·21 cites·10 claims
- 0498US9324570B1Method of manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 26, 2016·29 cites·11 claims
- 0597US9490217B1Overlay marks and semiconductor process using the overlay marksUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·12 cites·20 claims
- 0696US9660022B2Semiconductive device with a single diffusion break and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 23, 2017·17 cites·13 claims
- 0796US9530851B1Semiconductor device and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·15 cites·20 claims
- 0896US9397008B1Semiconductor device and manufacturing method of conductive structure in semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 19, 2016·14 cites·15 claims
- 0995US10504791B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 10, 2019·9 cites·20 claims
- 1095US9748139B1Method of fabricating dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·14 cites·8 claims
- 1195US9570339B2Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·11 cites·6 claims
- 1295US9543211B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 10, 2017·15 cites·17 claims
- 1394US10205005B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·8 cites·9 claims
- 1494US9607892B2Method for forming a two-layered hard mask on top of a gate structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 28, 2017·9 cites·7 claims
- 1594US9378973B1Method of using sidewall image transfer process to form fin-shaped structuresUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·10 cites·11 claims
- 1694US8823132B2Two-portion shallow-trench isolationUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·16 cites·6 claims
- 1793US10043807B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·9 cites·19 claims
- 1893US9837417B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·6 cites·20 claims
- 1993US9490341B2Semiconductor device having metal gate and method for manufacturing semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·8 cites·13 claims
- 2093US9006110B1Method for fabricating patterned structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 14, 2015·19 cites·17 claims
- 2192US10164039B2Semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 25, 2018·7 cites·7 claims
- 2291US10332877B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 25, 2019·7 cites·13 claims
- 2391US10153353B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·6 cites·20 claims
- 2491US9882054B2FinFET with merged, epitaxial source/drain regionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 30, 2018·6 cites·11 claims
- 2590US9385236B1Fin shaped semiconductor device structures having tipped end shape and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 5, 2016·9 cites·17 claims
- 2689US9653404B1Overlay target for optically measuring overlay alignment of layers formed on semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·10 cites·20 claims
- 2789US9318389B1Integrated circuit having plural transistors with work function metal gate structuresUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 19, 2016·10 cites·9 claims
- 2888US10177094B1Measurement mark and method for monitoring semiconductor processUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 8, 2019·4 cites·13 claims
- 2988US9548216B1Method of adjusting channel widths of semiconductive devicesUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 17, 2017·9 cites·12 claims
- 3088US9470987B1Overlay maskUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 18, 2016·5 cites·9 claims
- 3188US9337260B2Shallow trench isolation in bulk substrateUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 10, 2016·6 cites·10 claims
- 3287US10312353B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·3 cites·9 claims
- 3387US9466564B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·4 cites·11 claims
- 3487US9410902B1Overlay measurement methodUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 9, 2016·3 cites·16 claims
- 3587US8951918B2Method for fabricating patterned structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·9 cites·20 claims
- 3686US10453849B2Dynamic random access memory structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 22, 2019·6 cites·6 claims
- 3786US10134629B1Method for manufacturing a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 20, 2018·4 cites·11 claims
- 3886US9837511B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·3 cites·7 claims
- 3986US9722080B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 1, 2017·3 cites·16 claims
- 4085US9525041B2Semiconductor process for forming gates with different pitches and different dimensionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 20, 2016·4 cites·18 claims
- 4184US9871001B2Feeding overlay data of one layer to next layer for manufacturing integrated circuitUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 16, 2018·4 cites·17 claims
- 4284US9673049B2Manufacturing method of patterned structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 6, 2017·4 cites·13 claims
- 4383US10121790B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·2 cites·19 claims
- 4483US9482964B2Overlap mark set and method for selecting recipe of measuring overlap errorUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 1, 2016·4 cites·10 claims
- 4582US10763264B2Method for forming dynamic random access memory structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 1, 2020·4 cites·11 claims
- 4682US9837282B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·3 cites·12 claims
- 4781US10121704B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 6, 2018·2 cites·18 claims
- 4881US9754841B2Method of forming integrated circuit having plural transistors with work function metal gate structuresUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·3 cites·9 claims
- 4981US8642457B2Method of fabricating semiconductor deviceFU SSU-I·Filed 2011·Granted Feb 4, 2014·6 cites·20 claims
- 5079US9385220B2Semiconductor device having fin structure that includes dummy finsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 5, 2016·2 cites·4 claims
Showing the top 50 of 159 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →