Inventor · disambiguated record
Anne Miller
Also filed as: MILLER ANNE · MILLER ANNE E · MILLER ANNE F
26 granted patents·13 pending applications·441 citations·filing 1986–2018
96Inventor score
Files withINTEL CORP21FUJIMI INC5ANDRYUSHCHENKO TATYANA N2AMERICAN TELEPHONE & TELEGRAPH1BUEHLER MARK F1
Top patents by PatentIndex Score
39 records- 0195US7157378B2Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrodeINTEL CORP·Filed 2004·Granted Jan 2, 2007·107 cites·20 claims
- 0288US6596640B1Method of forming a raised contact for a substrateINTEL CORP·Filed 2002·Granted Jul 22, 2003·84 cites·18 claims
- 0388US6443814B1Method and chemistry for cleaning of oxidized copper during chemical mechanical polishingINTEL CORP·Filed 2001·Granted Sep 3, 2002·35 cites·9 claims
- 0487US7585760B2Method for forming planarizing copper in a low-k dielectricINTEL CORP·Filed 2006·Granted Sep 8, 2009·14 cites·20 claims
- 0585US6464568B2Method and chemistry for cleaning of oxidized copper during chemical mechanical polishingINTEL CORP·Filed 2000·Granted Oct 15, 2002·27 cites·18 claims
- 0683US6908863B2Sacrificial dielectric planarization layerINTEL CORP·Filed 2003·Granted Jun 21, 2005·24 cites·20 claims
- 0782US4790619AApparatus comprising Raman-active optical fiberAMERICAN TELEPHONE & TELEGRAPH·Filed 1986·Granted Dec 13, 1988·35 cites·12 claims
- 0878US7223685B2Damascene fabrication with electrochemical layer removalINTEL CORP·Filed 2003·Granted May 29, 2007·10 cites·33 claims
- 0977US9576818B2Polishing slurry for cobalt removalFUJIMI INC·Filed 2014·Granted Feb 21, 2017·4 cites·25 claims
- 1076US6852631B2Copper polish slurry for reduced interlayer dielectric erosion and method of using sameINTEL CORP·Filed 2002·Granted Feb 8, 2005·7 cites·5 claims
- 1175US7201784B2Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectricsINTEL CORP·Filed 2003·Granted Apr 10, 2007·18 cites·13 claims
- 1275US6740591B1Slurry and method for chemical mechanical polishing of copperINTEL CORP·Filed 2000·Granted May 25, 2004·17 cites·6 claims
- 1375US6719614B2Method and chemistry for cleaning of oxidized copper during chemical mechanical polishingINTEL CORP·Filed 2002·Granted Apr 13, 2004·13 cites·3 claims
- 1472US6719920B2Slurry for polishing a barrier layerINTEL CORP·Filed 2001·Granted Apr 13, 2004·12 cites·2 claims
- 1570US6787061B1Copper polish slurry for reduced interlayer dielectric erosion and method of using sameINTEL CORP·Filed 2000·Granted Sep 7, 2004·4 cites·14 claims
- 1668US7731864B2Slurry for chemical mechanical polishing of aluminumINTEL CORP·Filed 2005·Granted Jun 8, 2010·3 cites·8 claims
- 1765US6838383B2Copper polish slurry for reduced interlayer dielectric erosion and method of using sameINTEL CORP·Filed 2002·Granted Jan 4, 2005·2 cites·18 claims
- 1862US9150758B2Polishing composition, polishing method using same, and method for producing semiconductor deviceMILLER ANNE·Filed 2012·Granted Oct 6, 2015·1 cites·9 claims
- 1962US7109557B2Sacrificial dielectric planarization layerINTEL CORP·Filed 2004·Granted Sep 19, 2006·6 cites·4 claims
- 2059US10858543B2Anti-corrosion polishing compositionFUJIMI INC·Filed 2017·Granted Dec 8, 2020·0 cites·13 claims
- 2149US6752844B2Ceric-ion slurry for use in chemical-mechanical polishingINTEL CORP·Filed 1999·Granted Jun 22, 2004·11 cites·13 claims
- 2248US2004256224A1Damascene fabrication with electrochemical layer removalFiled 2003·Application pending·0 cites
- 2345US10570315B2Buffered slurry formulation for cobalt CMPFUJIMI INC·Filed 2017·Granted Feb 25, 2020·0 cites·13 claims
- 2445US7560380B2Chemical dissolution of barrier and adhesion layersINTEL CORP·Filed 2006·Granted Jul 14, 2009·0 cites·23 claims
- 2544US2019292405A1Slurries for chemical mechanical polishing of cobalt containing substratesFUJIMI INC·Filed 2018·Application pending·0 cites
- 2643US2004203245A1Ceric-ion slurry for use in chemical-mechanical polishingFiled 2004·Application pending·0 cites
- 2743US2004203227A1Ceric-ion slurry for use in chemical-mechanical polishingFiled 2004·Application pending·0 cites
- 2842US6909193B2High pH slurry for chemical mechanical polishing of copperINTEL CORP·Filed 2004·Granted Jun 21, 2005·0 cites·4 claims
- 2941US2014220779A1Surface selective polishing compositionsFUJIMI INC·Filed 2014·Application pending·0 cites
- 3040US2006124592A1Chemical mechanical polish slurryMILLER ANNE E·Filed 2004·Application pending·0 cites
- 3140US2003211745A1Slurry and method for chemical mechanical polishing of copperFiled 2003·Application pending·0 cites
- 3240US2008213995A1Ultrasonic electropolishing of conductive materialANDRYUSHCHENKO TATYANA N·Filed 2007·Application pending·0 cites
- 3339US2002177316A1Slurry and method for chemical mechanical polishing of copperFiled 2002·Application pending·0 cites
- 3438US6825117B2High PH slurry for chemical mechanical polishing of copperINTEL CORP·Filed 1999·Granted Nov 30, 2004·6 cites·9 claims
- 3538US2007298607A1Method for copper damascence fill for forming an interconnectANDRYUSHCHENKO TATYANA N·Filed 2006·Application pending·0 cites
- 3636US7666465B2Introducing nanotubes in trenches and structures formed therebyINTEL CORP·Filed 2004·Granted Feb 23, 2010·1 cites·16 claims
- 3736US2007152252A1Reducing aluminum dissolution in high pH solutionsBUEHLER MARK F·Filed 2005·Application pending·0 cites
- 3835US2006138087A1Copper containing abrasive particles to modify reactivity and performance of copper CMP slurriesSIMKA HARSONO S·Filed 2004·Application pending·0 cites
- 3933US2006046523A1Facilitating removal of sacrificial layers to form replacement metal gatesKAVALIEROS JACK·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →