Inventor · disambiguated record
Yoshitaka Toyoda
Also filed as: TOYODA YOSHITAKA
27 granted patents·3 pending applications·188 citations·filing 1997–2022
95Inventor score
Files withMITSUBISHI ELECTRIC CORP13SENJU METAL INDUSTRY CO9TOYODA YOSHITAKA3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1MORIYA SHOTARO1
Top patents by PatentIndex Score
30 records- 0190US7682468B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2007·Granted Mar 23, 2010·15 cites·9 claims
- 0285US6554180B1Lead-free solder pasteSENJU METAL INDUSTRY CO·Filed 2000·Granted Apr 29, 2003·37 cites·24 claims
- 0384US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0481US7338567B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Mar 4, 2008·19 cites·15 claims
- 0580US10699395B2Image processing device, image processing method, and image capturing deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 30, 2020·3 cites·11 claims
- 0680US6503338B1Lead-free solder alloysSENJU METAL INDUSTRY CO·Filed 2000·Granted Jan 7, 2003·21 cites·35 claims
- 0773US10255665B2Image processing device and method, image capturing device, program, and record mediumMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 9, 2019·2 cites·13 claims
- 0873US9770786B2Lead-free solder pasteTOYODA YOSHITAKA·Filed 2010·Granted Sep 26, 2017·5 cites·9 claims
- 0971US9875523B2Image processing apparatus and image processing methodMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 23, 2018·3 cites·9 claims
- 1070US10049432B2Image processing apparatus, image processing method, program and recording mediumMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 14, 2018·2 cites·19 claims
- 1169US9153015B2Image processing device and methodTOYODA YOSHITAKA·Filed 2012·Granted Oct 6, 2015·3 cites·13 claims
- 1267US10951817B2Compound-eye imaging device, image processing method, and recording mediumMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 16, 2021·1 cites·12 claims
- 1365US8216395B2Lead-free solder alloyMUNEKATA OSAMU·Filed 2010·Granted Jul 10, 2012·3 cites·9 claims
- 1465US6050480ASolder paste for chip componentsSENJU METAL INDUSTRY CO·Filed 1997·Granted Apr 18, 2000·18 cites·7 claims
- 1561US8648859B2Image display apparatus, image processing apparatus and method to output an image with high perceived resolutionTOYODA YOSHITAKA·Filed 2009·Granted Feb 11, 2014·1 cites·13 claims
- 1661US7029542B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Apr 18, 2006·8 cites·12 claims
- 1759US7282174B2Lead-free solder and soldered articleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 16, 2007·7 cites·14 claims
- 1856US9349168B2Image processing device and method to correct brightness signal of an input imageONDA Tsubasa·Filed 2013·Granted May 24, 2016·1 cites·10 claims
- 1954US7681777B2Solder paste and printed circuit boardSENJU METAL INDUSTRY CO·Filed 2004·Granted Mar 23, 2010·7 cites·19 claims
- 2053US8249379B2Image processing apparatus and method and image display apparatusMORIYA SHOTARO·Filed 2009·Granted Aug 21, 2012·0 cites·15 claims
- 2152US9779477B2Image enlarging apparatus, image enlarging method, surveillance camera, program and recording mediumMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 3, 2017·0 cites·20 claims
- 2250US2024345287A1Flood depth estimation apparatus, flood depth estimation method, computer readable medium, and training apparatusMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2344US10275970B2Signal processing device, signal processing method and information reading apparatusMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Apr 30, 2019·0 cites·19 claims
- 2441US10657629B2Image reading deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 19, 2020·0 cites·9 claims
- 2541US10506124B2Image reading apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 10, 2019·0 cites·13 claims
- 2641US2003021718A1Lead-free solder alloyFiled 2002·Application pending·0 cites
- 2740US11748852B2Pixel interpolation device and pixel interpolation method, and image processing device, and program and recording mediumMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 5, 2023·0 cites·17 claims
- 2839US2003021719A1Lead-free solder alloysSENJU METAL INDUSTRY CO·Filed 2002·Application pending·0 cites
- 2938US10269128B2Image processing device and method, and recording mediumMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 23, 2019·0 cites·13 claims
- 3038US9936098B2Image combination device, image reading device and image combination methodMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 3, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →