Inventor · disambiguated record
Aruna Manoharan
Also filed as: MANOHARAN ARUNA
3 granted patents·1 pending application·0 citations·filing 2017–2023
43Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0158US12087671B2Overmolded microelectronic packages containing knurled flanges and methods for the production thereofNXP USA INC·Filed 2021·Granted Sep 10, 2024·0 cites·15 claims
- 0251US2024395655A1Heat dissipation solutions for integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0350US10998255B2Overmolded microelectronic packages containing knurled flanges and methods for the production thereofNXP USA INC·Filed 2018·Granted May 4, 2021·0 cites·18 claims
- 0437US10134660B2Semiconductor device having corrugated leads and method for formingNXP USA INC·Filed 2017·Granted Nov 20, 2018·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →