Inventor · disambiguated record
Ayumu Tateoka
Also filed as: TATEOKA AYUMU
10 granted patents·1 pending application·6 citations·filing 2006–2022
78Inventor score
Files withMITSUI MINING & SMELTING CO4MITSUI MINING & SMELTING CO LTD3TATEOKA AYUMU2OBATA SHINICHI1TOMONAGA SAKIKO1
Top patents by PatentIndex Score
11 records- 0175US9066459B2Manufacturing method of multilayer printed wiring boardTATEOKA AYUMU·Filed 2012·Granted Jun 23, 2015·4 cites·13 claims
- 0273US9138964B2Surface-treated copper foilOBATA SHINICHI·Filed 2011·Granted Sep 22, 2015·1 cites·17 claims
- 0368US8419920B2Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper filmTOMONAGA SAKIKO·Filed 2007·Granted Apr 16, 2013·1 cites·11 claims
- 0462US12457686B2Roughened copper foil, copper-cladded laminate board, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·11 claims
- 0559US12104265B2Roughened copper foil, copper-clad laminate and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·10 claims
- 0652US12331212B2Resin composition, copper foil with resin, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·7 claims
- 0752US10244635B2Production method for copper-clad laminate plateMITSUI MINING & SMELTING CO·Filed 2017·Granted Mar 26, 2019·0 cites·8 claims
- 0851US2009166213A1Production method of electro-deposited copper foil, electro-deposited copper foil obtained by the production method, surface-treated copper foil obtained by using the electro-deposited copper foil and copper-clad laminate obtained by using the electro-deposited copper foil or the surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0946US10863621B2Metal foil with releasing resin layer, and printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Dec 8, 2020·0 cites·14 claims
- 1044US9585261B2Manufacturing method of multilayer printed wiring boardTATEOKA AYUMU·Filed 2012·Granted Feb 28, 2017·0 cites·9 claims
- 1134US10244640B2Copper clad laminate provided with protective layer and multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 26, 2019·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →