Inventor · disambiguated record
Huang-Sheng Lin
Also filed as: LIN HUANG-SHENG
8 granted patents·8 pending applications·88 citations·filing 2004–2025
83Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10TAIWAN SEMICONDUCTOR MFG4ANY COLOR INTERNATIONAL LTD1CHIN SHENG-CHI1
Top patents by PatentIndex Score
16 records- 0196US7378720B2Integrated stress relief pattern and registration structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 27, 2008·54 cites·11 claims
- 0283US7323784B2Top via pattern for bond pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 29, 2008·14 cites·12 claims
- 0379US2025300028A1Dummy Patterns in Redundant Region of Double Seal RingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US12341071B2Dummy patterns in redundant region of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·19 claims
- 0576US2025349758A1Wafer Level Multi-Die Structure FormationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US2025349634A1Forming Structures In Empty Regions On Wafers With Dual Seal Ring StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US7202550B2Integrated stress relief pattern and registration structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 10, 2007·20 cites·31 claims
- 0870US2025266374A1Semiconductor device having functional patterns in redundant regions of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0969US11728229B2Dummy patterns in redundant region of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1064US12300635B2Semiconductor device having functional patterns in redundant regions of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1163US2023402406A1Wafer Level Multi-Die Structure FormationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1262US2023402335A1Forming Structures In Empty Regions On Wafers With Dual Seal Ring StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1358US11855010B2Semiconductor structure and method for forming features in redundant region of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1457US2025179357A1Far-Infrared Emitting Material and Preparation Method ThereofANY COLOR INTERNATIONAL LTD·Filed 2023·Application pending·0 cites
- 1543US8626580B2Coupon-point system for managing supportive services to business in a semiconductor foundry environmentCHIN SHENG-CHI·Filed 2006·Granted Jan 7, 2014·0 cites·21 claims
- 1636US2006257790A1A semiconductor device structure and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →