Inventor · disambiguated record
Yeong Beom Ko
Also filed as: KO YEONG BEOM
22 granted patents·6 pending applications·81 citations·filing 2015–2025
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
28 records- 0196US9490231B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 8, 2016·14 cites·20 claims
- 0295US10134687B1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 20, 2018·24 cites·20 claims
- 0392US10056349B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 21, 2018·5 cites·20 claims
- 0491US10784178B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 22, 2020·7 cites·18 claims
- 0591US10410993B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·4 cites·20 claims
- 0690US12033910B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jul 9, 2024·2 cites·20 claims
- 0790US10381313B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·6 cites·20 claims
- 0890US9837376B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·4 cites·20 claims
- 0987US12327812B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Jun 10, 2025·0 cites·22 claims
- 1087US9741701B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·4 cites·20 claims
- 1186US11094645B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 1284US11158582B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Oct 26, 2021·3 cites·19 claims
- 1382US10290621B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2017·Granted May 14, 2019·2 cites·20 claims
- 1482US2025309129A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1580US12334450B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 17, 2025·0 cites·13 claims
- 1680US12255197B2Package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 1779US2025158007A1Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1879US2024363470A1Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1976US11901332B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2075US11121105B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 14, 2021·2 cites·17 claims
- 2173US11508712B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2272US11854991B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 2367US11031370B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 2463US10867984B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Dec 15, 2020·0 cites·6 claims
- 2561US11715714B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 2647US2024047425A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2745US2024055421A1Method for manufacturing semiconductor devices without thickness deviationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2835US2017162519A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →