Inventor · disambiguated record
Ping-Chang Wu
Also filed as: WU PING · WU PING-CHANG
16 granted patents·19 pending applications·230 citations·filing 2000–2013
93Inventor score
Top patents by PatentIndex Score
35 records- 0195US7387950B1Method for forming a metal structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 17, 2008·31 cites·10 claims
- 0291US6770963B1Multi-power ring chip scale package for system level integrationBROADCOM CORP·Filed 2001·Granted Aug 3, 2004·80 cites·41 claims
- 0389US7382038B2Semiconductor wafer and method for making the sameUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 3, 2008·14 cites·7 claims
- 0480US6424022B1Guard mesh for noise isolation in highly integrated circuitsMOBILINK TELECOM INC·Filed 2000·Granted Jul 23, 2002·44 cites·18 claims
- 0577US8039367B2Scribe line structure and method for dicing a waferUNITED MICROELECTRONICS CORP·Filed 2009·Granted Oct 18, 2011·5 cites·15 claims
- 0677US7649268B2Semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·4 cites·10 claims
- 0777US7129574B2Multi-power ring chip scale package for system level integrationBROADCOM CORP·Filed 2004·Granted Oct 31, 2006·24 cites·20 claims
- 0873US7795704B2Die seal ring and wafer having the sameUNITED MICROELECTRONICS CORP·Filed 2007·Granted Sep 14, 2010·6 cites·10 claims
- 0972US8610252B2Scribe line structure for wafer dicingWU PING-CHANG·Filed 2011·Granted Dec 17, 2013·2 cites·10 claims
- 1067US7485953B2Chip package structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Feb 3, 2009·4 cites·5 claims
- 1163US8115320B2Bond pad structure located over active circuit structureWU PING-CHANG·Filed 2008·Granted Feb 14, 2012·3 cites·26 claims
- 1263US6586292B2Guard mesh for noise isolation in highly integrated circuitsBROADCOM CORP·Filed 2002·Granted Jul 1, 2003·13 cites·9 claims
- 1358US9190359B2Scribe line structure for wafer dicing and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 17, 2015·0 cites·8 claims
- 1457US8013425B2Scribe line structure for wafer dicing and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 6, 2011·0 cites·6 claims
- 1555US7696606B2Metal structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Apr 13, 2010·0 cites·14 claims
- 1651US2008303168A1Structure for preventing pad peelingUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1748US2007111501A1Processing method for semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1848US2007269961A1Semiconductor wafer and method for making the sameWU PING-CHANG·Filed 2007·Application pending·0 cites
- 1946US8030778B2Integrated circuit structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Granted Oct 4, 2011·0 cites·17 claims
- 2046US2009283916A1Chip structure and method of reworking chipUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2145US2009014717A1Test ic structureUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2244US2008122105A1Structure for preventing pad peeling and method of fabricating the sameWU PING-CHANG·Filed 2006·Application pending·0 cites
- 2344US2009014870A1Semiconductor chip and package process for the sameUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2443US2008142606A1E-fuse bar code structure and method of using the sameWU PING-CHANG·Filed 2006·Application pending·0 cites
- 2543US2007108549A1Semiconductor structureWU PING-CHANG·Filed 2005·Application pending·0 cites
- 2643US2008164605A1Multi-chip packageUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2741US2008303177A1Bonding pad structureUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2841US2009033346A1Group probing over active area pads arrangementWU PING-CHANG·Filed 2007·Application pending·0 cites
- 2940US2008237854A1Method for forming contact padsWU PING-CHANG·Filed 2007·Application pending·0 cites
- 3040US2008246144A1Method for fabricating contact padsWU PING-CHANG·Filed 2007·Application pending·0 cites
- 3139US2007235872A1Semiconductor package structureWU PING-CHANG·Filed 2006·Application pending·0 cites
- 3239US2007102792A1Multi-layer crack stop structureWU PING-CHANG·Filed 2006·Application pending·0 cites
- 3338US2007210415A1Anti-fuse and programming method of the sameWU PING-CHANG·Filed 2006·Application pending·0 cites
- 3438US2007102791A1Structure of multi-layer crack stop ring and wafer having the sameWU PING-CHANG·Filed 2005·Application pending·0 cites
- 3536US2013009656A1Test pad structure on waferWU PING-CHANG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →